Inventor
JANG BOR-PING
TW42 patents
⚠️ This page may combine multiple inventors who share the name “JANG BOR-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
26 patentsUS10157881B2Dec 18, 2018
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10056285B2Aug 21, 2018
Semiconductor wafer device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9768142B2Sep 19, 2017
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9659891B2May 23, 2017
Semiconductor device having a boundary structure, a package on package structure, and a method of making
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9484226B2Nov 1, 2016
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10510712B2Dec 17, 2019
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276531B2Apr 30, 2019
Semiconductor device having a boundary structure, a package on package structure, and a method of making
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10020211B2Jul 10, 2018
Wafer-level molding chase design
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11390000B2Jul 19, 2022
Wafer level transfer molding and apparatus for performing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9893044B2Feb 13, 2018
Wafer-level underfill and over-molding
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9812346B2Nov 7, 2017
Semiconductor wafer device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11721555B2Aug 8, 2023
Method and system for thinning wafer thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11233032B2Jan 25, 2022
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11139177B2Oct 5, 2021
Method of fabricating semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094561B2Aug 17, 2021
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024618B2Jun 1, 2021
Wafer-level underfill and over-molding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10985135B2Apr 20, 2021
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10804234B2Oct 13, 2020
Semiconductor device having a boundary structure, a package on package structure, and a method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10770331B2Sep 8, 2020
Semiconductor wafer device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10727074B2Jul 28, 2020
Method and system for thinning wafer thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10679866B2Jun 9, 2020
Interconnect structure for semiconductor package and method of fabricating the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10513070B2Dec 24, 2019
Wafer level transfer molding and apparatus for performing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10504870B2Dec 10, 2019
Mechanisms for forming bonding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10134703B2Nov 20, 2018
Package on-package process for applying molding compound
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9802349B2Oct 31, 2017
Wafer level transfer molding and apparatus for performing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9129899B2Sep 8, 2015
Method and system for thinning wafer thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
11 patentsUS9093337B2Jul 28, 2015
Methods for controlling warpage in packaging
TAIWAN SEMICONDUCTOR MFG27 citations92
US8381965B2Feb 26, 2013
Thermal compress bonding
TAIWAN SEMICONDUCTOR MFG30 citations92
US5843831ADec 1, 1998
Process independent alignment system
TAIWAN SEMICONDUCTOR MFG41 citations90
US9082636B2Jul 14, 2015
Packaging methods and structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG4 citations73
US8556158B2Oct 15, 2013
Thermal compress bonding
TAIWAN SEMICONDUCTOR MFG4 citations63
US8616433B2Dec 31, 2013
Forming low stress joints using thermal compress bonding
TAIWAN SEMICONDUCTOR MFG2 citations62
US7005236B2Feb 28, 2006
Maintaining photoresist planarity at hole edges
TAIWAN SEMICONDUCTOR MFG3 citations60
US9236351B2Jan 12, 2016
Semiconductor wafer device
TAIWAN SEMICONDUCTOR MFG0 citations52
US9085049B2Jul 21, 2015
Method and system for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG0 citations52
US8360303B2Jan 29, 2013
Forming low stress joints using thermal compress bonding
TAIWAN SEMICONDUCTOR MFG1 citations51
US6778266B2Aug 17, 2004
Semiconductor wafer tilt monitoring on semiconductor fabrication equipment plate
TAIWAN SEMICONDUCTOR MFG4 citations51