Inventor

HUANG YING-JUI

TW45 patents

⚠️ This page may combine multiple inventors who share the name “HUANG YING-JUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG YING-JUI

TAIWAN SEMICONDUCTOR MFG CO LTD

Aligning bumps in fan-out packaging process

Integrated fan-out package and method of fabricating the same

Chip packages and methods of manufacture thereof

Pick-and-place tool for packaging process

Pillar bumps and process for making same

Chip packages and methods of manufacture thereof

Aligning bumps in fan-out packaging process

Lamination apparatus and method

Method and apparatus for bonding semiconductor substrate

Bonding with pre-deoxide process and apparatus for performing the same

Method and apparatus for bonding semiconductor substrate

Bonding with pre-deoxide process and apparatus for performing the same

Method of fabricating semiconductor package structure

Conductive micro pin

Semiconductor package structure

Pickup apparatus and method of using the same

Interconnect structure for semiconductor package and method of fabricating the interconnect structure

Method of manufacturing micro pins and isolated conductive micro pin

NANNING FUGUI PREC IND CO LTD

Holding and release device for sliding chassis in server

Anti-disassembly protection structure

Fan fixing device

Protective housing and cover mechanism thereof

Fan fixing device

Electronic device

Docking station and mobile terminal with the same

HON HAI PREC IND CO LTD

Anti-tamper device

Anti-data theft structures and electronic devices with the same

Cover operation mechanism

Anti-tamper device

Anti-data theft structures and electronic devices with the same

Cover with an opening structure

Electrical charger for charging electronic device

HWANG CHIEN LING

Thermal compressive bonding with separate die-attach and reflow processes

Method of forming semiconductor die

Thermal compressive bonding with separate die-attach and reflow processes

Pick-and-place tool for packaging process

Thermal compressive bond head

NANNING FULIAN FUGUI PREC INDUSTRIAL CO LTD

Electronic apparatus with mounting mechanism

Communication socket

LIN CHENG-CHUNG

Pillar bumps and process for making same

HONG FU JIN PREC IND (SHENZHEN) CO LTD

Anti-tamper mechanism and electronic device using the same

JANG BOR-PING

Innovative multi-purpose dipping plate

TAIWAN SEMICONDUCTOR MFG

Pick-and-place tool for packaging process

MSTAR SEMICONDUCTOR INC

Television system and method for managing applications therein

HUANG YING-JUI

Method for fabricating a multilayer microstructure with balancing residual stress capability