Inventor
LO HSIAOYUN
TW6 patents
Patents
6 patentsUS9842823B2Dec 12, 2017
Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US9449898B2Sep 20, 2016
Semiconductor device having backside interconnect structure through substrate via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11056419B2Jul 6, 2021
Semiconductor device having backside interconnect structure on through substrate via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10510641B2Dec 17, 2019
Semiconductor device having backside interconnect structure on through substrate via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12322680B2Jun 3, 2025
Semiconductor device having backside interconnect structure on through substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11823979B2Nov 21, 2023
Method of forming semiconductor device having backside interconnect structure on through substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62