Inventor · disambiguated record
Hong-Ye Shih
Also filed as: SHIH HONG-YE
12 granted patents·2 pending applications·19 citations·filing 2013–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14
Top patents by PatentIndex Score
14 records- 0188US9449898B2Semiconductor device having backside interconnect structure through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·6 cites·20 claims
- 0287US9786580B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 10, 2017·8 cites·17 claims
- 0385US10510641B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·18 claims
- 0485US2025266325A1Semiconductor Device Having Backside Interconnect Structure on Through Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0584US12322680B2Semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0677US11056419B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·19 claims
- 0775US11823979B2Method of forming semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 0875US2024347506A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0969US10672737B2Three-dimensional integrated circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·1 cites·20 claims
- 1066US12051672B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
- 1162US11004741B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 1258US10566237B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
- 1355US10163705B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·0 cites·20 claims
- 1453US10074595B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →