Inventor
Yeh Shu-Shen
TW135 patents
Patents
50 patentsUS11749644B2Sep 5, 2023
Semiconductor device with curved conductive lines and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US11264359B2Mar 1, 2022
Chip bonded to a redistribution structure with curved conductive lines
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations86
US9870975B1Jan 16, 2018
Chip package with thermal dissipation structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9721868B2Aug 1, 2017
Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US12300568B2May 13, 2025
High efficiency heat dissipation using discrete thermal interface material films
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US12040267B2Jul 16, 2024
Organic interposer including intra-die structural reinforcement structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11984378B2May 14, 2024
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11967582B2Apr 23, 2024
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11915991B2Feb 27, 2024
Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11908757B2Feb 20, 2024
Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11854929B2Dec 26, 2023
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11830800B2Nov 28, 2023
Metallization structure and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11823991B2Nov 21, 2023
Frames stacked on substrate encircling devices and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11798897B2Oct 24, 2023
Package structure and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11784061B2Oct 10, 2023
Chip package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11784130B2Oct 10, 2023
Structure and formation method of package with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11699668B2Jul 11, 2023
Semiconductor device package having warpage control and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11637087B2Apr 25, 2023
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11610835B2Mar 21, 2023
Organic interposer including intra-die structural reinforcement structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11594477B2Feb 28, 2023
Semiconductor package and method of manufacturing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11574861B2Feb 7, 2023
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11450622B2Sep 20, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11011447B2May 18, 2021
Semiconductor package and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10714463B2Jul 14, 2020
Method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10504880B2Dec 10, 2019
Method of forming semicondcutor device package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276551B2Apr 30, 2019
Semiconductor device package and method of forming semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9748156B1Aug 29, 2017
Semiconductor package assembly, semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11854956B2Dec 26, 2023
Semiconductor die package with conductive line crack prevention design
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11328971B2May 10, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10109547B2Oct 23, 2018
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12322703B2Jun 3, 2025
Eccentric via structures for stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12255156B2Mar 18, 2025
Semiconductor package with riveting structure between two rings and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12568820B2Mar 3, 2026
Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12557645B2Feb 17, 2026
Semiconductor packages with thermal lid and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12512399B2Dec 30, 2025
Semiconductor package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12500208B2Dec 16, 2025
Integrated fan-out package having stress release structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12489027B2Dec 2, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12406936B2Sep 2, 2025
Semiconductor package with substrate recess and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12406897B2Sep 2, 2025
Package structure with buffer layer embedded in lid layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12374636B2Jul 29, 2025
Semiconductor device package with stress reduction design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12374561B2Jul 29, 2025
Chip package structure with ring dam
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12362197B2Jul 15, 2025
Semiconductor die package with ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12347793B2Jul 1, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12327772B2Jun 10, 2025
Semiconductor package including stress-reduction structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12278156B2Apr 15, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12255118B2Mar 18, 2025
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12249568B2Mar 11, 2025
Metallization structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12237277B2Feb 25, 2025
Package structure and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12232307B2Feb 18, 2025
Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12218023B2Feb 4, 2025
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
Showing the top 50 of 135 patents by PatentIndex Score.