Inventor
YEE JAE HAK
SG34 patents
⚠️ This page may combine multiple inventors who share the name “YEE JAE HAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
13 patentsUS6858919B2Feb 22, 2005
Semiconductor package
AMKOR TECHNOLOGY INC130 citations99
US6759737B2Jul 6, 2004
Semiconductor package including stacked chips with aligned input/output pads
AMKOR TECHNOLOGY INC105 citations98
US6677663B1Jan 13, 2004
End grid array semiconductor package
AMKOR TECHNOLOGY INC100 citations98
US6646339B1Nov 11, 2003
Thin and heat radiant semiconductor package and method for manufacturing
AMKOR TECHNOLOGY INC111 citations98
US6448633B1Sep 10, 2002
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC258 citations98
US6953988B2Oct 11, 2005
Semiconductor package
AMKOR TECHNOLOGY INC60 citations96
US6627976B1Sep 30, 2003
Leadframe for semiconductor package and mold for molding the same
AMKOR TECHNOLOGY INC64 citations96
US6521987B1Feb 18, 2003
Plastic integrated circuit device package and method for making the package
AMKOR TECHNOLOGY INC104 citations96
US6525406B1Feb 25, 2003
Semiconductor device having increased moisture path and increased solder joint strength
AMKOR TECHNOLOGY INC69 citations95
US7057280B2Jun 6, 2006
Leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC14 citations92
US6825062B2Nov 30, 2004
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC26 citations92
US6555899B1Apr 29, 2003
Semiconductor package leadframe assembly and method of manufacture
AMKOR TECHNOLOGY INC34 citations92
US7564122B2Jul 21, 2009
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC6 citations73
YEE JAE HAK
6 patentsUS8501540B2Aug 6, 2013
Method for manufacture of inline integrated circuit system
YEE JAE HAK4 citations61
US9202776B2Dec 1, 2015
Stackable multi-chip package system
YEE JAE HAK0 citations51
US8937372B2Jan 20, 2015
Integrated circuit package system with molded strip protrusion
YEE JAE HAK0 citations51
US8847413B2Sep 30, 2014
Integrated circuit package system with leads having multiple sides exposed
YEE JAE HAK1 citations51
US8810019B2Aug 19, 2014
Integrated circuit package system with stacked die
YEE JAE HAK0 citations50
US8138591B2Mar 20, 2012
Integrated circuit package system with stacked die
YEE JAE HAK0 citations50
STATS CHIPPAC LTD
5 patentsUS7622333B2Nov 24, 2009
Integrated circuit package system for package stacking and manufacturing method thereof
STATS CHIPPAC LTD14 citations84
US7968981B2Jun 28, 2011
Inline integrated circuit system
STATS CHIPPAC LTD8 citations83
US7645638B2Jan 12, 2010
Stackable multi-chip package system with support structure
STATS CHIPPAC LTD13 citations83
US7915738B2Mar 29, 2011
Stackable multi-chip package system with support structure
STATS CHIPPAC LTD0 citations51
US8018039B2Sep 13, 2011
Integrated circuit package system with stacked devices
STATS CHIPPAC LTD0 citations39