Inventor · disambiguated record
Joo Hun Park
Also filed as: PARK JOO H · PARK JOO HUN
6 granted patents·2 pending applications·146 citations·filing 2002–2017
84Inventor score
Top patents by PatentIndex Score
8 records- 0187US6670206B2Method for fabricating surface acoustic wave filter packagesSAMSUNG ELECTRO MECH·Filed 2002·Granted Dec 30, 2003·51 cites·11 claims
- 0284US7045385B2Method for fabricating surface acoustic wave filter packages and package sheet used thereinSAMSUNG ELECTRO MECH·Filed 2003·Granted May 16, 2006·46 cites·11 claims
- 0383US6928719B2Method for fabricating surface acoustic wave filter packageSAMSUNG ELECTRO MECH·Filed 2002·Granted Aug 16, 2005·38 cites·9 claims
- 0475US7820468B2Stack type surface acoustic wave package, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Oct 26, 2010·6 cites·9 claims
- 0569US7336017B2Stack type surface acoustic wave package, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 26, 2008·5 cites·13 claims
- 0643US2007145541A1Stack type surface acoustic wave package, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0740US2006250049A1Surface acoustic wave device packageSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 0833US10546827B2Flip chipWISOL CO LTD·Filed 2017·Granted Jan 28, 2020·0 cites·5 claims
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