Inventor

KIM OHHAN

KR33 patents

⚠️ This page may combine multiple inventors who share the name “KIM OHHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM OHHAN

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming an integrated SIP module with embedded inductor or package

Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant

Semiconductor device and method of forming an integrated SiP module with embedded inductor or package

Semiconductor device and method of forming SIP module over film layer

Method of forming SIP module over film layer

Cooling device and process for cooling double-sided SiP devices during sputtering

Cooling device and process for cooling double-sided SiP devices during sputtering

Cooling device and process for cooling double-sided SiP devices during sputtering

Semiconductor device and method of forming protrusion e-bar for 3D SiP

STATS CHIPPAC LTD

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process

Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage

KIM OHHAN

Semiconductor device and method of forming WLCSP structure using protruded MLP

Semiconductor device and method of forming a thermally reinforced semiconductor die

Semiconductor device and method of forming WLCSP structure using protruded MLP

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

CHOI DAESIK

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

KIM SUN MI

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV