Inventor · disambiguated record
Tomoya Yamazawa
Also filed as: YAMAZAWA TOMOYA
3 granted patents·1 pending application·0 citations·filing 2014–2022
40Inventor score
Technology areasH10W
Files withNAMICS CORP4
Top patents by PatentIndex Score
4 records- 0148US2024132714A1Epoxy resin composition, semiconductor device, and method of producing semiconductor deviceNAMICS CORP·Filed 2022·Application pending·0 cites
- 0243US10196513B2Epoxy resin composition, semiconductor sealing agent, and semiconductor deviceNAMICS CORP·Filed 2014·Granted Feb 5, 2019·0 cites·15 claims
- 0342US9947604B2Epoxy resin composition, semiconductor sealing agent, and semiconductor deviceNAMICS CORP·Filed 2014·Granted Apr 17, 2018·0 cites·8 claims
- 0432US10941280B2Liquid sealing material for copper bump, and resin composition for use as sameNAMICS CORP·Filed 2015·Granted Mar 9, 2021·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →