Inventor
TSAI HSIN-CHANG
TW33 patents
⚠️ This page may combine multiple inventors who share the name “TSAI HSIN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DELTA ELECTRONICS INC
19 patentsUS9385070B2Jul 5, 2016
Semiconductor component having a lateral semiconductor device and a vertical semiconductor device
DELTA ELECTRONICS INC9 citations83
US9177957B1Nov 3, 2015
Embedded packaging device
DELTA ELECTRONICS INC13 citations83
US9431327B2Aug 30, 2016
Semiconductor device
DELTA ELECTRONICS INC4 citations72
US11049796B2Jun 29, 2021
Manufacturing method of packaging device
DELTA ELECTRONICS INC0 citations62
US10685904B2Jun 16, 2020
Packaging device and manufacturing method thereof
DELTA ELECTRONICS INC1 citations62
US8912663B1Dec 16, 2014
Embedded package structure and method for manufacturing thereof
DELTA ELECTRONICS INC2 citations62
US7528472B2May 5, 2009
Chip package mechanism
DELTA ELECTRONICS INC2 citations61
US9159699B2Oct 13, 2015
Interconnection structure having a via structure
DELTA ELECTRONICS INC3 citations57
US10892210B2Jan 12, 2021
Package structures
DELTA ELECTRONICS INC0 citations51
US10424508B2Sep 24, 2019
Interconnection structure having a via structure and fabrication thereof
DELTA ELECTRONICS INC0 citations51
US9905439B2Feb 27, 2018
Power module package having patterned insulation metal substrate
DELTA ELECTRONICS INC0 citations51
US9865531B2Jan 9, 2018
Power module package having patterned insulation metal substrate
DELTA ELECTRONICS INC0 citations51
US9748165B2Aug 29, 2017
Packaging structure
DELTA ELECTRONICS INC0 citations51
US9275982B2Mar 1, 2016
Method of forming interconnection structure of package structure
DELTA ELECTRONICS INC0 citations51
US9209164B2Dec 8, 2015
Interconnection structure of package structure and method of forming the same
DELTA ELECTRONICS INC1 citations51
US10056319B2Aug 21, 2018
Power module package having patterned insulation metal substrate
DELTA ELECTRONICS INC0 citations49
US10741644B2Aug 11, 2020
Semiconductor devices with via structure and package structures comprising the same
DELTA ELECTRONICS INC0 citations48
US9184111B2Nov 10, 2015
Wafer-level chip scale package
DELTA ELECTRONICS INC0 citations42
US9847312B2Dec 19, 2017
Package structure
DELTA ELECTRONICS INC0 citations41
ACTRON TECH CORP
7 patentsUS11183439B2Nov 23, 2021
Package structure for power device
ACTRON TECH CORP2 citations73
US11177188B1Nov 16, 2021
Heat dissipation substrate for multi-chip package
ACTRON TECH CORP4 citations73
US12532440B2Jan 20, 2026
Heat dissipation structure and power module
ACTRON TECH CORP0 citations62
US12408281B2Sep 2, 2025
Circuit substrate and electronic device
ACTRON TECH CORP0 citations52
US11810835B2Nov 7, 2023
Intelligent power module packaging structure
ACTRON TECH CORP0 citations52
US11232992B2Jan 25, 2022
Power device package structure
ACTRON TECH CORP0 citations52
US10804189B2Oct 13, 2020
Power device package structure
ACTRON TECH CORP0 citations51