Inventor
LEE PENG-HSIN
TW17 patents
Patents
17 patentsUS9385070B2Jul 5, 2016
Semiconductor component having a lateral semiconductor device and a vertical semiconductor device
DELTA ELECTRONICS INC9 citations83
US9177957B1Nov 3, 2015
Embedded packaging device
DELTA ELECTRONICS INC13 citations83
US9431327B2Aug 30, 2016
Semiconductor device
DELTA ELECTRONICS INC4 citations72
US11049796B2Jun 29, 2021
Manufacturing method of packaging device
DELTA ELECTRONICS INC0 citations62
US10685904B2Jun 16, 2020
Packaging device and manufacturing method thereof
DELTA ELECTRONICS INC1 citations62
US8912663B1Dec 16, 2014
Embedded package structure and method for manufacturing thereof
DELTA ELECTRONICS INC2 citations62
US11315857B2Apr 26, 2022
Package structures
DELTA ELECTRONICS INC0 citations61
US10892210B2Jan 12, 2021
Package structures
DELTA ELECTRONICS INC0 citations51
US10424508B2Sep 24, 2019
Interconnection structure having a via structure and fabrication thereof
DELTA ELECTRONICS INC0 citations51
US9905439B2Feb 27, 2018
Power module package having patterned insulation metal substrate
DELTA ELECTRONICS INC0 citations51
US9865531B2Jan 9, 2018
Power module package having patterned insulation metal substrate
DELTA ELECTRONICS INC0 citations51
US9748165B2Aug 29, 2017
Packaging structure
DELTA ELECTRONICS INC0 citations51
US9275982B2Mar 1, 2016
Method of forming interconnection structure of package structure
DELTA ELECTRONICS INC0 citations51
US9209164B2Dec 8, 2015
Interconnection structure of package structure and method of forming the same
DELTA ELECTRONICS INC1 citations51
US11189555B2Nov 30, 2021
Chip packaging with multilayer conductive circuit
DELTA ELECTRONICS INC0 citations50
US10056319B2Aug 21, 2018
Power module package having patterned insulation metal substrate
DELTA ELECTRONICS INC0 citations49
US9847312B2Dec 19, 2017
Package structure
DELTA ELECTRONICS INC0 citations41