Inventor

SCHNEEGANS MANFRED

DE51 patents

⚠️ This page may combine multiple inventors who share the name “SCHNEEGANS MANFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHNEEGANS MANFRED

INFINEON TECHNOLOGIES AG

Method for fabricating thin metal layers from the liquid phase

Process for the back-surface grinding of wafers

Multi-layer metal pads

Probe needle for testing semiconductor chips and method for producing said probe needle

Method of making an integrated circuit including singulating a semiconductor wafer

Semiconductor body with layer of solder material comprising chromium

Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer

Production method for a semiconductor component

Method of manufacturing a layer structure having partially sealed pores

Method of manufacturing an electronic device having a contact pad with partially sealed pores

Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer

Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device

Terminal structure of a power semiconductor device

Method for producing a copper layer on a semiconductor body using a printing process

Semiconductor device

Method for processing a die

Singulation of semiconductor dies with contact metallization by electrical discharge machining

Semiconductor device having peripheral polymer structures

Methods for treating wafers on assembly carriers

Semiconductor device with metal structure electrically connected to a conductive structure

Semiconductor device with metal structure electrically connected to a conductive structure

Source down semiconductor devices and methods of formation thereof

Source down semiconductor devices and methods of formation thereof

Semiconductor device comprising a protective structure on a chip backside and method of producing the same

Ultrathin semiconductor circuit having contact bumps

Electronic device including a nickel-palladium alloy layer

Methods for fabricating a contact for an integrated circuit

Electrolyte, method of forming a copper layer and method of forming a chip

Multi-layer metal pads

Method of forming a bondpad and bondpad

Semiconductor device including trench transistor cell array and manufacturing method

Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement

SCHNEEGANS MANFRED

Method for producing a semiconductor component

Electronic device

Electronic device

Semiconductor device

Integrated circuit including bond wire directly bonded to pad

Multilayer metallization with stress-reducing interlayer

KROENINGER WERNER

Device for treating wafers on assembly carriers

Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer

Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer

SIEMENS AG

Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly

Method of producing an aluminum film

MOTOROLA INC

Apparatus for and method of wafer grinding

SEMICONDUCTOR 300 GMBH & CO KG

Apparatus and method for measuring the degradation of a tool

INFINEON TECHOLOGIES AG

Method for production of a semiconductor component

QIMONDA AG

Chip carrier with reduced interference signal sensitivity

MUELLER DIRK

Methods for producing an ultrathin semiconductor circuit

EDER HANNES

Device including a semiconductor chip and a carrier and fabrication method

INFINEON TECHNOLOGIES AUSTRIA AG

Method of processing a porous conductive structure in connection to an electronic component on a substrate