P

Inventor

WANG CHENG-CHI

TW60 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHENG-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INNOLUX CORP

26 patents
US11551970B2Jan 10, 2023

Method for manufacturing an electronic device

INNOLUX CORP2 citations72
US11769685B2Sep 26, 2023

Manufacturing method of semiconductor package

INNOLUX CORP2 citations71
US12185461B2Dec 31, 2024

Electronic device

INNOLUX CORP2 citations70
US12238863B2Feb 25, 2025

Electronic device and method for forming the same

INNOLUX CORP0 citations63
US12308289B2May 20, 2025

Method for manufacturing an electronic device

INNOLUX CORP0 citations62
US12224226B2Feb 11, 2025

Electronic device

INNOLUX CORP0 citations62
US12148630B2Nov 19, 2024

Method for manufacturing electronic device

INNOLUX CORP0 citations62
US12148658B2Nov 19, 2024

Method for manufacturing an electronic device

INNOLUX CORP0 citations62
US12142554B2Nov 12, 2024

Electronic component and manufacturing method thereof

INNOLUX CORP0 citations62
US11721560B2Aug 8, 2023

Manufacturing method of semiconductor device

INNOLUX CORP0 citations62
US11127604B2Sep 21, 2021

Manufacturing method of semiconductor device

INNOLUX CORP0 citations62
US11488899B2Nov 1, 2022

Package device

INNOLUX CORP0 citations61
US11075155B2Jul 27, 2021

Package structure and manufacturing method thereof

INNOLUX CORP1 citations60
US11062979B2Jul 13, 2021

High-frequency device and manufacturing method thereof

INNOLUX CORP0 citations60
US10490493B2Nov 26, 2019

Package structure and manufacturing method thereof

INNOLUX CORP1 citations60
US12424454B2Sep 23, 2025

Composite layer circuit element

INNOLUX CORP0 citations59
US12148685B2Nov 19, 2024

Redistribution layer structure

INNOLUX CORP0 citations59
US12131917B2Oct 29, 2024

Manufacturing method of package structure

INNOLUX CORP0 citations59
US12107036B2Oct 1, 2024

Redistribution layer structure and manufacturing method thereof

INNOLUX CORP0 citations59
US11764077B2Sep 19, 2023

Composite layer circuit element and manufacturing method thereof

INNOLUX CORP0 citations59
US12408269B2Sep 2, 2025

Electronic device and method of forming electronic device

INNOLUX CORP0 citations53
US10910285B2Feb 2, 2021

Package structure with TFTS and die covered RDL

INNOLUX CORP0 citations51
US12308296B2May 20, 2025

Electronic device and manufacturing method thereof

INNOLUX CORP0 citations50
US12230558B2Feb 18, 2025

Package device

INNOLUX CORP0 citations50
US10707152B2Jul 7, 2020

High-frequency device and manufacturing method thereof

INNOLUX CORP0 citations50
US12482778B2Nov 25, 2025

Electronic device and method of fabricating an electronic device

INNOLUX CORP0 citations49

CHI MEI OPTOELECTRONICS CORP

5 patents

OBI PHARMA INC

5 patents

ROCKWELL INTERNATIONAL CORP

3 patents

WONG CHI-HUEY

2 patents

ACADEMIA SINICA

2 patents

US ARMY

2 patents

(unassigned)

1 patent

FERMIONICS CORP

1 patent

IND TECH RES INST

1 patent

CHI MEI OPTOELECTRNICS CORP

1 patent

CHIMEI INNOLUX CORP

1 patent

Showing the top 50 of 60 patents by PatentIndex Score.