Inventor
WANG CHENG-CHI
TW60 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHENG-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INNOLUX CORP
26 patentsUS11551970B2Jan 10, 2023
Method for manufacturing an electronic device
INNOLUX CORP2 citations72
US11769685B2Sep 26, 2023
Manufacturing method of semiconductor package
INNOLUX CORP2 citations71
US12185461B2Dec 31, 2024
Electronic device
INNOLUX CORP2 citations70
US12238863B2Feb 25, 2025
Electronic device and method for forming the same
INNOLUX CORP0 citations63
US12308289B2May 20, 2025
Method for manufacturing an electronic device
INNOLUX CORP0 citations62
US12224226B2Feb 11, 2025
Electronic device
INNOLUX CORP0 citations62
US12148630B2Nov 19, 2024
Method for manufacturing electronic device
INNOLUX CORP0 citations62
US12148658B2Nov 19, 2024
Method for manufacturing an electronic device
INNOLUX CORP0 citations62
US12142554B2Nov 12, 2024
Electronic component and manufacturing method thereof
INNOLUX CORP0 citations62
US11721560B2Aug 8, 2023
Manufacturing method of semiconductor device
INNOLUX CORP0 citations62
US11127604B2Sep 21, 2021
Manufacturing method of semiconductor device
INNOLUX CORP0 citations62
US11488899B2Nov 1, 2022
Package device
INNOLUX CORP0 citations61
US11075155B2Jul 27, 2021
Package structure and manufacturing method thereof
INNOLUX CORP1 citations60
US11062979B2Jul 13, 2021
High-frequency device and manufacturing method thereof
INNOLUX CORP0 citations60
US10490493B2Nov 26, 2019
Package structure and manufacturing method thereof
INNOLUX CORP1 citations60
US12424454B2Sep 23, 2025
Composite layer circuit element
INNOLUX CORP0 citations59
US12148685B2Nov 19, 2024
Redistribution layer structure
INNOLUX CORP0 citations59
US12131917B2Oct 29, 2024
Manufacturing method of package structure
INNOLUX CORP0 citations59
US12107036B2Oct 1, 2024
Redistribution layer structure and manufacturing method thereof
INNOLUX CORP0 citations59
US11764077B2Sep 19, 2023
Composite layer circuit element and manufacturing method thereof
INNOLUX CORP0 citations59
US12408269B2Sep 2, 2025
Electronic device and method of forming electronic device
INNOLUX CORP0 citations53
US10910285B2Feb 2, 2021
Package structure with TFTS and die covered RDL
INNOLUX CORP0 citations51
US12308296B2May 20, 2025
Electronic device and manufacturing method thereof
INNOLUX CORP0 citations50
US12230558B2Feb 18, 2025
Package device
INNOLUX CORP0 citations50
US10707152B2Jul 7, 2020
High-frequency device and manufacturing method thereof
INNOLUX CORP0 citations50
US12482778B2Nov 25, 2025
Electronic device and method of fabricating an electronic device
INNOLUX CORP0 citations49
CHI MEI OPTOELECTRONICS CORP
5 patentsUS6620527B2Sep 16, 2003
Hillock-free aluminum wiring layer and method of forming the same
CHI MEI OPTOELECTRONICS CORP10 citations74
US6771338B2Aug 3, 2004
Transflective liquid crystal display having transflective electrodes of an aluminum compound
CHI MEI OPTOELECTRONICS CORP4 citations63
US7432140B2Oct 7, 2008
Thin film transistor, thin film transistor substrate, and methods for manufacturing the same
CHI MEI OPTOELECTRONICS CORP0 citations52
US7238556B2Jul 3, 2007
Thin film transistor structure and method of manufacturing the same
CHI MEI OPTOELECTRONICS CORP0 citations52
US7015508B2Mar 21, 2006
Thin film transistor structure
CHI MEI OPTOELECTRONICS CORP0 citations52
OBI PHARMA INC
5 patentsUS10815307B2Oct 27, 2020
Antibodies, pharmaceutical compositions and uses thereof
OBI PHARMA INC5 citations72
US9902779B2Feb 27, 2018
Antibodies, pharmaceutical compositions and uses thereof
OBI PHARMA INC2 citations72
US10935544B2Mar 2, 2021
Glycan arrays and method of use
OBI PHARMA INC2 citations66
US11752204B2Sep 12, 2023
Vaccines with higher carbohydrate antigen density and novel saponin adjuvant
OBI PHARMA INC0 citations60
US10517936B2Dec 31, 2019
Vaccines with higher carbohydrate antigen density and novel saponin adjuvant
OBI PHARMA INC0 citations50
ROCKWELL INTERNATIONAL CORP
3 patentsUS4183035AJan 8, 1980
Inverted heterojunction photodiode
ROCKWELL INTERNATIONAL CORP19 citations79
US4315477AFeb 16, 1982
Semi-open liquid phase epitaxial growth system
ROCKWELL INTERNATIONAL CORP10 citations69
US4263065AApr 21, 1981
Semi-open liquid phase epitaxial growth system
ROCKWELL INTERNATIONAL CORP7 citations69
WONG CHI-HUEY
2 patentsACADEMIA SINICA
2 patentsUS ARMY
2 patents(unassigned)
1 patentFERMIONICS CORP
1 patentIND TECH RES INST
1 patentCHI MEI OPTOELECTRNICS CORP
1 patentCHIMEI INNOLUX CORP
1 patentShowing the top 50 of 60 patents by PatentIndex Score.