Inventor · disambiguated record
Chee Siang Ong
Also filed as: ONG CHEE-SIANG
3 granted patents·1 pending application·21 citations·filing 2007–2013
67Inventor score
Top patents by PatentIndex Score
4 records- 0190US9875973B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersSTATS CHIPPAC LTD·Filed 2013·Granted Jan 23, 2018·11 cites·17 claims
- 0289US8492203B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersLIN YAOJIAN·Filed 2011·Granted Jul 23, 2013·10 cites·13 claims
- 0352US9520365B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersSTATS CHIPPAC LTD·Filed 2012·Granted Dec 13, 2016·0 cites·24 claims
- 0439US2009042388A1Method of cleaning a semiconductor substrateSUN ZHI-QIANG·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →