Inventor
MURAKAMI SEISHI
JP27 patents
⚠️ This page may combine multiple inventors who share the name “MURAKAMI SEISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
23 patentsUS5709757AJan 20, 1998
Film forming and dry cleaning apparatus and method
TOKYO ELECTRON LTD160 citations99
US5462603AOct 31, 1995
Semiconductor processing apparatus
TOKYO ELECTRON LTD183 citations99
US5595606AJan 21, 1997
Shower head and film forming apparatus using the same
TOKYO ELECTRON LTD1,174 citations98
US5690743ANov 25, 1997
Liquid material supply apparatus and method
TOKYO ELECTRON LTD79 citations96
US5963834AOct 5, 1999
Method for forming a CVD film
TOKYO ELECTRON LTD62 citations94
US6126994AOct 3, 2000
Liquid material supply apparatus and method
TOKYO ELECTRON LTD16 citations92
US5704214AJan 6, 1998
Apparatus for removing tramp materials and method therefor
TOKYO ELECTRON LTD28 citations92
US5522412AJun 4, 1996
Vacuum treatment apparatus and a cleaning method therefor
TOKYO ELECTRON LTD40 citations92
US7351291B2Apr 1, 2008
Semiconductor processing system
TOKYO ELECTRON LTD7 citations74
US6169032B1Jan 2, 2001
CVD film formation method
TOKYO ELECTRON LTD11 citations74
US6153515ANov 28, 2000
Method of forming multilayered film
TOKYO ELECTRON LTD14 citations74
USRE36925EOct 31, 2000
Vacuum treatment apparatus and a method for manufacturing semiconductor device therein
TOKYO ELECTRON LTD7 citations74
US5088697AFeb 18, 1992
Heat treating apparatus
TOKYO ELECTRON LTD7 citations71
US10950417B2Mar 16, 2021
Substrate processing apparatus and substrate loading mechanism
TOKYO ELECTRON LTD2 citations70
US5880526AMar 9, 1999
Barrier metal layer
TOKYO ELECTRON LTD6 citations63
US11965242B2Apr 23, 2024
Raw material supply apparatus and raw material supply method
TOKYO ELECTRON LTD0 citations62
US10221478B2Mar 5, 2019
Film formation device
TOKYO ELECTRON LTD1 citations61
US9984892B2May 29, 2018
Oxide film removing method, oxide film removing apparatus, contact forming method, and contact forming system
TOKYO ELECTRON LTD1 citations51
US9349642B2May 24, 2016
Method of forming contact layer
TOKYO ELECTRON LTD1 citations51
US11348794B2May 31, 2022
Semiconductor film forming method using hydrazine-based compound gas
TOKYO ELECTRON LTD0 citations46
US10546753B2Jan 28, 2020
Method of removing silicon oxide film
TOKYO ELECTRON LTD0 citations41
US9620370B2Apr 11, 2017
Method of forming Ti film
TOKYO ELECTRON LTD0 citations41
US8021717B2Sep 20, 2011
Film formation method, cleaning method and film formation apparatus
TOKYO ELECTRON LTD0 citations39