Inventor
YANG WENGE
US33 patents
⚠️ This page may combine multiple inventors who share the name “YANG WENGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
29 patentsUS6372651B1Apr 16, 2002
Method for trimming a photoresist pattern line for memory gate etching
ADVANCED MICRO DEVICES INC220 citations99
US6416933B1Jul 9, 2002
Method to produce small space pattern using plasma polymerization layer
ADVANCED MICRO DEVICES INC56 citations96
US6482699B1Nov 19, 2002
Method for forming self-aligned contacts and local interconnects using decoupled local interconnect process
ADVANCED MICRO DEVICES INC37 citations93
US6306713B1Oct 23, 2001
Method for forming self-aligned contacts and local interconnects for salicided gates using a secondary spacer
ADVANCED MICRO DEVICES INC40 citations93
US6515328B1Feb 4, 2003
Semiconductor devices with reduced control gate dimensions
ADVANCED MICRO DEVICES INC20 citations92
US6383939B1May 7, 2002
Method for etching memory gate stack using thin resist layer
ADVANCED MICRO DEVICES INC16 citations92
US6271154B1Aug 7, 2001
Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile
ADVANCED MICRO DEVICES INC28 citations92
US6159860ADec 12, 2000
Method for etching layers on a semiconductor wafer in a single etching chamber
ADVANCED MICRO DEVICES INC23 citations92
US6136649AOct 24, 2000
Method for removing anti-reflective coating layer using plasma etch process after contact CMP
ADVANCED MICRO DEVICES INC32 citations92
US5977601ANov 2, 1999
Method for etching memory gate stack using thin resist layer
ADVANCED MICRO DEVICES INC25 citations92
US5973353AOct 26, 1999
Methods and arrangements for forming a tapered floating gate in non-volatile memory semiconductor devices
ADVANCED MICRO DEVICES INC30 citations92
US5948703ASep 7, 1999
Method of soft-landing gate etching to prevent gate oxide damage
ADVANCED MICRO DEVICES INC34 citations92
US6878622B1Apr 12, 2005
Method for forming SAC using a dielectric as a BARC and FICD enlarger
ADVANCED MICRO DEVICES INC16 citations84
US6365509B1Apr 2, 2002
Semiconductor manufacturing method using a dielectric photomask
ADVANCED MICRO DEVICES INC18 citations84
US6291296B1Sep 18, 2001
Method for removing anti-reflective coating layer using plasma etch process before contact CMP
ADVANCED MICRO DEVICES INC18 citations84
US6596623B1Jul 22, 2003
Use of organic spin on materials as a stop-layer for local interconnect, contact and via layers
ADVANCED MICRO DEVICES INC8 citations74
US6359307B1Mar 19, 2002
Method for forming self-aligned contacts and interconnection lines using dual damascene techniques
ADVANCED MICRO DEVICES INC13 citations74
US6348406B1Feb 19, 2002
Method for using a low dielectric constant layer as a semiconductor anti-reflective coating
ADVANCED MICRO DEVICES INC11 citations74
US6218310B1Apr 17, 2001
RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile
ADVANCED MICRO DEVICES INC7 citations74
US6159794ADec 12, 2000
Methods for removing silicide residue in a semiconductor device
ADVANCED MICRO DEVICES INC12 citations74
US6110779AAug 29, 2000
Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride
ADVANCED MICRO DEVICES INC15 citations74
US6074956AJun 13, 2000
Method for preventing silicide residue formation in a semiconductor device
ADVANCED MICRO DEVICES INC14 citations74
US6534411B1Mar 18, 2003
Method of high density plasma metal etching
ADVANCED MICRO DEVICES INC3 citations63
US6452225B1Sep 17, 2002
Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride
ADVANCED MICRO DEVICES INC3 citations63
US6423612B1Jul 23, 2002
Method of fabricating a shallow trench isolation structure with reduced topography
ADVANCED MICRO DEVICES INC2 citations63
US6376389B1Apr 23, 2002
Method for eliminating anti-reflective coating in semiconductors
ADVANCED MICRO DEVICES INC5 citations63
US6207575B1Mar 27, 2001
Local interconnect etch characterization using AFM
ADVANCED MICRO DEVICES INC6 citations54
US6627526B1Sep 30, 2003
Method for fabricating a conductive structure for a semiconductor device
ADVANCED MICRO DEVICES INC1 citations52
US6420240B1Jul 16, 2002
Method for reducing the step height of shallow trench isolation structures
ADVANCED MICRO DEVICES INC1 citations52