P

Inventor

YANG WENGE

US33 patents
⚠️ This page may combine multiple inventors who share the name “YANG WENGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

29 patents
US6372651B1Apr 16, 2002

Method for trimming a photoresist pattern line for memory gate etching

ADVANCED MICRO DEVICES INC220 citations99
US6416933B1Jul 9, 2002

Method to produce small space pattern using plasma polymerization layer

ADVANCED MICRO DEVICES INC56 citations96
US6482699B1Nov 19, 2002

Method for forming self-aligned contacts and local interconnects using decoupled local interconnect process

ADVANCED MICRO DEVICES INC37 citations93
US6306713B1Oct 23, 2001

Method for forming self-aligned contacts and local interconnects for salicided gates using a secondary spacer

ADVANCED MICRO DEVICES INC40 citations93
US6515328B1Feb 4, 2003

Semiconductor devices with reduced control gate dimensions

ADVANCED MICRO DEVICES INC20 citations92
US6383939B1May 7, 2002

Method for etching memory gate stack using thin resist layer

ADVANCED MICRO DEVICES INC16 citations92
US6271154B1Aug 7, 2001

Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile

ADVANCED MICRO DEVICES INC28 citations92
US6159860ADec 12, 2000

Method for etching layers on a semiconductor wafer in a single etching chamber

ADVANCED MICRO DEVICES INC23 citations92
US6136649AOct 24, 2000

Method for removing anti-reflective coating layer using plasma etch process after contact CMP

ADVANCED MICRO DEVICES INC32 citations92
US5977601ANov 2, 1999

Method for etching memory gate stack using thin resist layer

ADVANCED MICRO DEVICES INC25 citations92
US5973353AOct 26, 1999

Methods and arrangements for forming a tapered floating gate in non-volatile memory semiconductor devices

ADVANCED MICRO DEVICES INC30 citations92
US5948703ASep 7, 1999

Method of soft-landing gate etching to prevent gate oxide damage

ADVANCED MICRO DEVICES INC34 citations92
US6878622B1Apr 12, 2005

Method for forming SAC using a dielectric as a BARC and FICD enlarger

ADVANCED MICRO DEVICES INC16 citations84
US6365509B1Apr 2, 2002

Semiconductor manufacturing method using a dielectric photomask

ADVANCED MICRO DEVICES INC18 citations84
US6291296B1Sep 18, 2001

Method for removing anti-reflective coating layer using plasma etch process before contact CMP

ADVANCED MICRO DEVICES INC18 citations84
US6596623B1Jul 22, 2003

Use of organic spin on materials as a stop-layer for local interconnect, contact and via layers

ADVANCED MICRO DEVICES INC8 citations74
US6359307B1Mar 19, 2002

Method for forming self-aligned contacts and interconnection lines using dual damascene techniques

ADVANCED MICRO DEVICES INC13 citations74
US6348406B1Feb 19, 2002

Method for using a low dielectric constant layer as a semiconductor anti-reflective coating

ADVANCED MICRO DEVICES INC11 citations74
US6218310B1Apr 17, 2001

RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile

ADVANCED MICRO DEVICES INC7 citations74
US6159794ADec 12, 2000

Methods for removing silicide residue in a semiconductor device

ADVANCED MICRO DEVICES INC12 citations74
US6110779AAug 29, 2000

Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride

ADVANCED MICRO DEVICES INC15 citations74
US6074956AJun 13, 2000

Method for preventing silicide residue formation in a semiconductor device

ADVANCED MICRO DEVICES INC14 citations74
US6534411B1Mar 18, 2003

Method of high density plasma metal etching

ADVANCED MICRO DEVICES INC3 citations63
US6452225B1Sep 17, 2002

Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride

ADVANCED MICRO DEVICES INC3 citations63
US6423612B1Jul 23, 2002

Method of fabricating a shallow trench isolation structure with reduced topography

ADVANCED MICRO DEVICES INC2 citations63
US6376389B1Apr 23, 2002

Method for eliminating anti-reflective coating in semiconductors

ADVANCED MICRO DEVICES INC5 citations63
US6207575B1Mar 27, 2001

Local interconnect etch characterization using AFM

ADVANCED MICRO DEVICES INC6 citations54
US6627526B1Sep 30, 2003

Method for fabricating a conductive structure for a semiconductor device

ADVANCED MICRO DEVICES INC1 citations52
US6420240B1Jul 16, 2002

Method for reducing the step height of shallow trench isolation structures

ADVANCED MICRO DEVICES INC1 citations52

TIMBRE TECH INC

1 patent

TOKYO ELECTRON LTD

1 patent

SPANSION LLC

1 patent

HPSTAR BEIJING

1 patent