Inventor

STREET BRET K

US82 patents

⚠️ This page may combine multiple inventors who share the name “STREET BRET K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STREET BRET K

MICRON TECHNOLOGY INC

Method and apparatus for marking a bare semiconductor die

Methods for marking a bare semiconductor die

Method and apparatus for marking a bare semiconductor die

Molded ball grid array

Method for in-line testing of flip-chip semiconductor assemblies

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same

Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same

Die package having an adhesive flow restriction area

Methods for marking a bare semiconductor die including applying a tape having energy-markable properties

Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape

Molded ball grid array

Semiconductor device with a layered protection mechanism and associated systems, devices, and methods

Methods of manufacturing multi-die semiconductor device packages and related assemblies

Methods of processing wafer-level assemblies to reduce warpage, and related assemblies

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Methods of fabricating a molded ball grid array

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for manufacturing flip-chip semiconductor assembly

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Method for in-line testing of flip-chip semiconductor assemblies

Semiconductor device with a protection mechanism and associated systems, devices, and methods

Combination-bonded die pair packaging and associated systems and methods

Semiconductor device with a protection mechanism and associated systems, devices, and methods

Electrically or temperature activated shape-memory materials for warpage control

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Semiconductor device with a protection mechanism and associated systems, devices, and methods

Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods

Methods of manufacturing multi-die semiconductor device packages and related assemblies

Methods of processing wafer-level assemblies to reduce warpage, and related assemblies

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Method and apparatus for gate blocking X-outs during a molding process

Method and apparatus for gate blocking X-outs during a molding process

Method for gate blocking x-outs during a molding process

Grindable heat sink for multiple die packaging

Combination-bonded die pair packaging and associated systems and methods

Electrically or temperature activated shape-memory materials for warpage control

Semiconductor device with a layered protection mechanism and associated systems, devices, and methods

Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods

Semiconductor device with a layered protection mechanism and associated systems, devices, and methods

Heat sinks including nonlinear passageways

APTINA IMAGING CORP

Microelectronic imaging units

Microelectronic imaging units having covered image sensors