Inventor
FUNARI JOSEPH
US28 patents
Patents
28 patentsUS5241454AAug 31, 1993
Mutlilayered flexible circuit package
IBM222 citations98
US5261155ANov 16, 1993
Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
IBM145 citations97
US5203075AApr 20, 1993
Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
IBM313 citations97
US5907903AJun 1, 1999
Multi-layer-multi-chip pyramid and circuit board structure and method of forming same
IBM129 citations96
US5715144AFeb 3, 1998
Multi-layer, multi-chip pyramid and circuit board structure
IBM149 citations96
US5222649AJun 29, 1993
Apparatus for soldering a semiconductor device to a circuitized substrate
IBM80 citations96
US5207372AMay 4, 1993
Method for soldering a semiconductor device to a circuitized substrate
IBM60 citations96
US5109318AApr 28, 1992
Pluggable electronic circuit package assembly with snap together heat sink housing
IBM233 citations96
US4171477AOct 16, 1979
Micro-surface welding
IBM97 citations96
US5744759AApr 28, 1998
Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
IBM102 citations95
US5321884AJun 21, 1994
Multilayered flexible circuit package
IBM50 citations95
US5565119AOct 15, 1996
Method and apparatus for soldering with a multiple tip and associated optical fiber heating device
IBM61 citations94
US5553769ASep 10, 1996
Interconnection of a carrier substrate and a semiconductor device
IBM57 citations94
US5435732AJul 25, 1995
Flexible circuit member
IBM75 citations94
US5003429AMar 26, 1991
Electronic assembly with enhanced heat sinking
IBM60 citations94
US5920125AJul 6, 1999
Interconnection of a carrier substrate and a semiconductor device
IBM49 citations93
US5859470AJan 12, 1999
Interconnection of a carrier substrate and a semiconductor device
IBM51 citations93
US4849856AJul 18, 1989
Electronic package with improved heat sink
IBM103 citations93
US5211328AMay 18, 1993
Method of applying solder
IBM33 citations92
US4670325AJun 2, 1987
Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
IBM44 citations92
US5115964AMay 26, 1992
Method for bonding thin film electronic device
IBM25 citations91
US5057969AOct 15, 1991
Thin film electronic device
IBM36 citations91
US4294729AOct 13, 1981
Composition containing alcohol and use thereof for epoxy removal
IBM48 citations91
US5028984AJul 2, 1991
Epoxy composition and use thereof
IBM27 citations90
US6070785AJun 6, 2000
Process for manufacturing boards that can accept a pluggable tab module that can be attached or removed without solder
IBM23 citations89
US4392617AJul 12, 1983
Spray head apparatus
IBM41 citations89
US4434134AFeb 28, 1984
Pinned ceramic substrate
IBM30 citations86
US5190595AMar 2, 1993
Ozone safe stripping solution for thermal grease
IBM12 citations73