Inventor
LEE SANG JAE
JP50 patents
⚠️ This page may combine multiple inventors who share the name “LEE SANG JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NGK INSULATORS LTD
8 patentsUS7153402B2Dec 26, 2006
NOx-decomposing electrode and NOx concentration-measuring apparatus
NGK INSULATORS LTD7 citations74
US7156966B2Jan 2, 2007
Nox-decomposing electrode and NOx concentration-measuring apparatus
NGK INSULATORS LTD6 citations63
US6796175B2Sep 28, 2004
Gas sensor, gas sensor installation structure, and method for installing gas sensor
NGK INSULATORS LTD4 citations62
US11442036B2Sep 13, 2022
Sensor element and gas sensor
NGK INSULATORS LTD0 citations52
US7943024B2May 17, 2011
Porous electrode and process of producing the same
NGK INSULATORS LTD1 citations52
US7497933B2Mar 3, 2009
Gas sensor
NGK INSULATORS LTD1 citations52
US6857316B2Feb 22, 2005
Gas sensor, gas sensor installation structure, and method for installing gas sensor
NGK INSULATORS LTD1 citations52
US7527718B2May 5, 2009
Method of treating gas sensor element
NGK INSULATORS LTD0 citations42
SAMSUNG ELECTRO MECH
6 patentsUS10779414B2Sep 15, 2020
Electronic component embedded printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations72
US11037716B2Jun 15, 2021
Inductor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations62
US10586648B2Mar 10, 2020
Coil component and method for manufacturing the same
SAMSUNG ELECTRO MECH1 citations61
US10529476B2Jan 7, 2020
Coil component and method for manufacturing the same
SAMSUNG ELECTRO MECH1 citations61
US10952329B2Mar 16, 2021
Copper clad laminates and method for manufacturing a printed circuit board using the same
SAMSUNG ELECTRO MECH1 citations59
US10825600B2Nov 3, 2020
Coil component and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations35
ELECTRONICS & TELECOMMUNICATIONS RES INST
5 patentsUS11115202B2Sep 7, 2021
Apparatus for generating secret information on basis of ring oscillator architecture and method of same
ELECTRONICS & TELECOMMUNICATIONS RES INST2 citations72
US11336444B2May 17, 2022
Hardware security module for verifying executable code, device having hardware security module, and method of operating device
ELECTRONICS & TELECOMMUNICATIONS RES INST2 citations71
US11329835B2May 10, 2022
Apparatus and method for authenticating IoT device based on PUF using white-box cryptography
ELECTRONICS & TELECOMMUNICATIONS RES INST1 citations62
US12185099B2Dec 31, 2024
Module and method for transmitting information using wireless hidden signal
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US11726668B2Aug 15, 2023
Device with flash memory and method for writing/erasing/updating data in flash memory thereof
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations50
SAMSUNG ELECTRONICS CO LTD
4 patentsUS5812483ASep 22, 1998
Integrated circuit memory devices including split word lines and predecoders and related methods
SAMSUNG ELECTRONICS CO LTD32 citations92
US7724572B2May 25, 2010
Integrated circuit having a non-volatile memory cell transistor as a fuse device
SAMSUNG ELECTRONICS CO LTD5 citations73
US7085179B2Aug 1, 2006
Integrated circuit having a non-volatile memory cell transistor as a fuse device
SAMSUNG ELECTRONICS CO LTD7 citations73
US6118722ASep 12, 2000
Integrated circuit memory device
SAMSUNG ELECTRONICS CO LTD5 citations62
HYUNDAI MOTOR CO LTD
2 patentsLG ELECTRONICS INC
2 patentsCJ CHEILJEDANG CORP
2 patentsUS10494686B2Dec 3, 2019
Composition for epimerization of non-phosphorylated hexose comprising sugar epimerases derived from thermophiles
CJ CHEILJEDANG CORP0 citations51
US9914984B2Mar 13, 2018
Composition for epimerization of non-phosphorylated hexose comprising sugar epimerases derived from thermophiles
CJ CHEILJEDANG CORP0 citations51