Copper clad laminates and method for manufacturing a printed circuit board using the same

Abstract

A copper clad laminate and a method to manufacture the same are provided. In one general aspect, a copper clad laminate include a first copper clad layer on a first surface of an insulating layer, and a second copper clad layer on a second surface of the insulating layer. The second copper clad layer includes polymer resin layer, a second copper layer, and a carrier foil layer.

What is claimed is: 
     
       1. A copper clad laminate, comprising:
 a first copper clad layer made of copper directly disposed on a first outer surface of an insulating layer comprising a reinforcing material, a filler and a resin; and 
 a second copper clad layer directly disposed on a second outer surface of the insulating layer opposite the first outer surface of the insulating layer, 
 wherein the second copper clad layer comprises a polymer resin layer directly disposed on the second outer surface of the insulating layer, a second copper layer made of copper directly disposed on the polymer resin layer, and a carrier foil layer directly disposed on the second copper layer, 
 wherein the first copper clad layer is an exposed exterior of the copper clad laminate, 
 wherein the polymer resin layer consists of at least one selected from the group consisting of a polyamide-imide, a liquid crystal polymer, a cyclic olefin polymer and a mixture thereof, and 
 wherein the carrier foil layer comprises a benzotriazole-based organic remover or a metallic remover as a remover coating. 
 
     
     
       2. The copper clad laminate of  claim 1 , wherein the reinforcing material is at least one selected from the group consisting of glass fiber fabrics, glass fiber nonwovens, carbon fiber fabrics and organic polymer fiber fabrics. 
     
     
       3. The copper clad laminate of  claim 1 , wherein the filler is at least one selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate and a mixture thereof.