Inventor · disambiguated record
Sang Jae Lee
Also filed as: LEE SANG J · LEE SANG M · LEE SANG Y · LEE SANG-HYUP
51 granted patents·44 pending applications·208 citations·filing 1995–2025
97Inventor score
Files withQUALCOMM INC18ELECTRONICS & TELECOMMUNICATIONS RES INST11SAMSUNG ELECTRO MECH10NGK INSULATORS LTD9SAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
95 records- 0188US8464573B2Gas concentration detection sensorSEKIYA TAKAYUKI·Filed 2010·Granted Jun 18, 2013·8 cites·9 claims
- 0286USD860895SFront door panel for an automobileHYUNDAI MOTOR CO LTD·Filed 2017·Granted Sep 24, 2019·26 cites·1 claims
- 0384US11336444B2Hardware security module for verifying executable code, device having hardware security module, and method of operating deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted May 17, 2022·2 cites·19 claims
- 0478US10779414B2Electronic component embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Sep 15, 2020·3 cites·13 claims
- 0578US10586648B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 10, 2020·1 cites·26 claims
- 0678US10529476B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 7, 2020·1 cites·12 claims
- 0776US11329835B2Apparatus and method for authenticating IoT device based on PUF using white-box cryptographyELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted May 10, 2022·1 cites·17 claims
- 0875US11115202B2Apparatus for generating secret information on basis of ring oscillator architecture and method of sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Sep 7, 2021·2 cites·10 claims
- 0975US10494686B2Composition for epimerization of non-phosphorylated hexose comprising sugar epimerases derived from thermophilesCJ CHEILJEDANG CORP·Filed 2018·Granted Dec 3, 2019·0 cites·8 claims
- 1075USD859255SRear door panel for an automobileHYUNDAI MOTOR CO LTD·Filed 2018·Granted Sep 10, 2019·15 cites·1 claims
- 1175US8584504B2Ammonia concentration detection sensorITO TAKASHI·Filed 2010·Granted Nov 19, 2013·2 cites·3 claims
- 1271US5812483AIntegrated circuit memory devices including split word lines and predecoders and related methodsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Sep 22, 1998·32 cites·21 claims
- 1370US8506780B2Gas sensorMURAKAMI MIKA·Filed 2010·Granted Aug 13, 2013·2 cites·10 claims
- 1468US7664131B2Channel resource assignment method for fair channel resource reservation and QoS in mesh WPANKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Feb 16, 2010·4 cites·5 claims
- 1567US7153402B2NOx-decomposing electrode and NOx concentration-measuring apparatusNGK INSULATORS LTD·Filed 2003·Granted Dec 26, 2006·7 cites·5 claims
- 1666US9914984B2Composition for epimerization of non-phosphorylated hexose comprising sugar epimerases derived from thermophilesCJ CHEILJEDANG CORP·Filed 2014·Granted Mar 13, 2018·0 cites·7 claims
- 1766US7724572B2Integrated circuit having a non-volatile memory cell transistor as a fuse deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 25, 2010·5 cites·7 claims
- 1865US12448066B2Rubber track unitLS MTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·9 claims
- 1965US10870783B2Surfactant adhesive compositionKOLLODIS BIOSCIENCES INC·Filed 2016·Granted Dec 22, 2020·1 cites·11 claims
- 2065US8398836B2Gas sensorHORISAKA SUMIKO·Filed 2010·Granted Mar 19, 2013·2 cites·19 claims
- 2165US7943024B2Porous electrode and process of producing the sameNGK INSULATORS LTD·Filed 2006·Granted May 17, 2011·1 cites·4 claims
- 2265US2025066720A1Gf binding ecm mimetic coated microcarrierSTELO BIOTECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2364US6796175B2Gas sensor, gas sensor installation structure, and method for installing gas sensorNGK INSULATORS LTD·Filed 2003·Granted Sep 28, 2004·4 cites·10 claims
- 2463US2025143481A1Seat cushion for chair and seat for chair including the sameSIDIZ INC·Filed 2025·Application pending·0 cites
- 2562US10952329B2Copper clad laminates and method for manufacturing a printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 16, 2021·1 cites·3 claims
- 2662US2025372479A1Package comprising an integrated device, a substrate and a heat sinkQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2761US11037716B2Inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 15, 2021·0 cites·6 claims
- 2861US8409414B2Gas sensor and nitrogen oxide sensorMIYASHITA TAKEYA·Filed 2009·Granted Apr 2, 2013·1 cites·25 claims
- 2961US2025293136A1Buried bump structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3061US2025132262A1Device with side-by-side integrated circuit devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3161US2025316575A1Die-first metallization structure and substrate interposer hybrid packageQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3261US2025273585A1Package comprising substrates and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3360US2025253217A1Package comprising substrates with post interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3460US2025080146A1Apparatus and method for controlling power amplifier in low-orbit satellite networkELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 3560US2024214115A1Method and apparatus for transmitting signals using frequency hoppingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3660US2025183178A1Bridge die in substrate core layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3759US5658062ALight amount controlling apparatus and method for projectorLG ELECTRONICS INC·Filed 1995·Granted Aug 19, 1997·25 cites·8 claims
- 3859US2025098066A1Package comprising a substrate with an interconnect blockQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3958US6857316B2Gas sensor, gas sensor installation structure, and method for installing gas sensorNGK INSULATORS LTD·Filed 2004·Granted Feb 22, 2005·1 cites·10 claims
- 4058US2025062246A1Structure for delamination mitigation in a semiconductor deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4158US2025062235A1Package substrate with metallization layer(s) that includes an additional metal pad layer to facilitate reduced via size for reduced bump pitch, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4258US2025046688A1Integrated device including direct memory attachment on through mold conductorsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4358US2025096051A1Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4457US12185099B2Module and method for transmitting information using wireless hidden signalELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Dec 31, 2024·0 cites·16 claims
- 4557US7497933B2Gas sensorNGK INSULATORS LTD·Filed 2003·Granted Mar 3, 2009·1 cites·12 claims
- 4657US7156966B2Nox-decomposing electrode and NOx concentration-measuring apparatusNGK INSULATORS LTD·Filed 2003·Granted Jan 2, 2007·6 cites·3 claims
- 4757US2025079281A1Package substrate employing film substrate and an outer pre-impregnated (ppg) substrate(s) to support high density bump and wire bond connections, and related hybrid integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4856US2024274516A1Interposer with solder resist postsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4956US2024321752A1Package substrate comprising embedded integrated deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 5056US2024332146A1Integrated circuit (ic) package employing metal posts thermally coupling a die to an interposer substrate for dissipating thermal energy of the die, and related fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 95 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Sang Jae Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →