Inventor
SONG DU-HEON
KR27 patents
⚠️ This page may combine multiple inventors who share the name “SONG DU-HEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
20 patentsUS7279774B2Oct 9, 2007
Bulk substrates in FinFETs with trench insulation surrounding FIN pairs having FINs separated by recess hole shallower than trench
SAMSUNG ELECTRONICS CO LTD26 citations92
US7524733B2Apr 28, 2009
Asymmetric source/drain transistor employing selective epitaxial growth (SEG) layer and method of fabricating same
SAMSUNG ELECTRONICS CO LTD9 citations84
US7402871B2Jul 22, 2008
Semiconductor device having resistor and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7221023B2May 22, 2007
Asymmetric source/drain transistor employing selective epitaxial growth (SEG) layer and method of fabricating same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7153733B2Dec 26, 2006
Method of fabricating fin field effect transistor using isotropic etching technique
SAMSUNG ELECTRONICS CO LTD14 citations84
US6861313B2Mar 1, 2005
Semiconductor memory device and fabrication method thereof using damascene bitline process
SAMSUNG ELECTRONICS CO LTD13 citations84
US7378320B2May 27, 2008
Method of forming asymmetric MOS transistor with a channel stopping region and a trench-type gate
SAMSUNG ELECTRONICS CO LTD8 citations74
US7323746B2Jan 29, 2008
Recess gate-type semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations72
US10529736B2Jan 7, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations71
US7491603B2Feb 17, 2009
Transistors of semiconductor device having channel region in a channel-portion hole and methods of forming the same
SAMSUNG ELECTRONICS CO LTD5 citations63
US7205208B2Apr 17, 2007
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations63
US7429505B2Sep 30, 2008
Method of fabricating fin field effect transistor using isotropic etching technique
SAMSUNG ELECTRONICS CO LTD2 citations62
US7393769B2Jul 1, 2008
Transistor of a semiconductor device having a punchthrough protection layer and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US7354827B2Apr 8, 2008
Transistor having asymmetric channel region, semiconductor device including the same, and method of fabricating semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US10896917B2Jan 19, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US7534708B2May 19, 2009
Recessed-type field effect transistor with reduced body effect
SAMSUNG ELECTRONICS CO LTD2 citations61
US7300845B2Nov 27, 2007
Method of manufacturing recess type MOS transistor having a dual diode impurity layer structure
SAMSUNG ELECTRONICS CO LTD3 citations61
US7696570B2Apr 13, 2010
Transistors of semiconductor device having channel region in a channel-portion hole and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7034368B2Apr 25, 2006
Semiconductor memory device and fabrication method thereof using damascene gate and epitaxial growth
SAMSUNG ELECTRONICS CO LTD1 citations52
US6844233B2Jan 18, 2005
Semiconductor memory device and fabrication method thereof using damascene gate and epitaxial growth
SAMSUNG ELECTRONICS CO LTD0 citations52
LG SEMICON CO LTD
5 patentsUS5686331ANov 11, 1997
Fabrication method for semiconductor device
LG SEMICON CO LTD57 citations96
US6090692AJul 18, 2000
Fabrication method for semiconductor memory device
LG SEMICON CO LTD25 citations92
US5942450AAug 24, 1999
Method of fabricating semiconductor device
LG SEMICON CO LTD25 citations92
US5849626ADec 15, 1998
Method for forming isolation region of semiconductor device
LG SEMICON CO LTD7 citations74
US5895258AApr 20, 1999
Semiconductor device fabrication method
LG SEMICON CO LTD3 citations63