Fabrication method for semiconductor memory device

Abstract

A fabrication method for a semiconductor memory device includes the steps of forming a gate pattern on a semiconductor substrate; forming first and second sidewall spacers at sides of the gate pattern; performing an ion=implantation of a high concentration impurity using the gate pattern and the first and second sidewall spacers as a mask, thereby forming an impurity diffusion region in the semiconductor substrate; performing an ion-implantation of a transition metal on the semiconductor substrate including the gate pattern and the first and second sidewall spacers, and then forming a polysilicide and a silicide by annealing; and removing the second sidewall spacers.

What is claimed is: 
     
       1. A fabrication method for a semiconductor memory device, comprising the steps of: forming a gate pattern on a semiconductor substrate;   forming first sidewall spacers and second sidewall spacers at sides of the gate pattern;   performing an ion-implantation of an impurity using the gate pattern and the first and second spacers as a mask, thereby forming an impurity diffusion region in the semiconductor substrate;   performing an ion-implantation of a transition metal on the semiconductor substrate including the gate pattern and the first and second sidewall spacers, and then forming a polysilicide and a silicide by annealing; and   removing the second sidewall spacers.   
     
     
       2. The fabrication method of claim 1, wherein the step for forming the first and second sidewall spacers includes the steps of: depositing a first insulating film on the semiconductor substrate including the gate pattern;   forming the first sidewall spacers at sides of the gate pattern by anisotropically-etching the first insulating film;   depositing a second insulating film on the substrate including the gate pattern and the first sidewall spacers; and   forming the second sidewall spacers by anisotropically-etching the second insulating film.   
     
     
       3. The fabrication method of claim 1, wherein the first sidewall spacers have an etching selectivity from the second sidewall spacers. 
     
     
       4. The fabrication method of claim 1, wherein the first sidewall spacers include an oxide film. 
     
     
       5. The fabrication method of claim 1, wherein the second sidewall spacers include a nitride film. 
     
     
       6. The fabrication method of claim 1, wherein the transition metal is one of the group consisting of cobalt, molybdenum, tungsten and titanium. 
     
     
       7. The fabrication method of claim 1, wherein the step of ion-implantation of the transition metal is performed with a substrate temperature of approximately 300 to 400° C., a concentration of the transition metal of approximately 1-7×10 16  cm -2  and an ion-implantation energy of approximately 20-30 KeV. 
     
     
       8. The fabrication method of claim 1, wherein the annealing is carried out in a temperature range of approximately 600 to 850° C. 
     
     
       9. The fabrication method of claim 1, wherein the second sidewall spacers are removed by wet-etching. 
     
     
       10. A fabrication method for a semiconductor memory device, comprising the steps of: forming a gate pattern on a substrate;   forming first and second sidewall spacers on at least one side of the gate pattern;   performing a first ion-implantation of an impurity, thereby forming an impurity diffusion region in a portion of the substrate;   forming a polysilicide on the gate pattern and a silicide on the impurity diffusion region; and   removing the second sidewall spacers.   
     
     
       11. The fabrication method of claim 10, further comprising the step of performing a second ion-implantation of the impurity to form an impurity ion-implantation region in the substrate, wherein the impurity ion-implantation region has a lower concentration of the impurity than the impurity diffusion region. 
     
     
       12. The fabrication method of claim 10, wherein the step of performing the first ion-implantation of the impurity is done by using the gate pattern and the first and second sidewall spacers as a mask. 
     
     
       13. The fabrication method of claim 10, wherein the step of forming the polysilicide and the silicide includes the steps of: performing an ion-implantation of a transition metal on the substrate including the gate pattern;   annealing to form the polysilicide on the gate pattern and to form the silicide on an upper portion of the impurity diffusion region.   
     
     
       14. The fabrication method of claim 10, wherein the second sidewall spacers are removed by wet-etching. 
     
     
       15. The fabrication method of claim 14, wherein the wet-etching is performed using a phosphoric acid (H 3  PO 4 ) solution. 
     
     
       16. The fabrication method of claim 10, wherein the step of forming the first and second sidewall spacers includes the steps of: depositing a first insulating film on the semiconductor substrate including the gate pattern;   forming the first sidewall spacers at sides of the gate pattern by anisotropically-etching the first insulating film;   depositing a second insulating film on the substrate including the gate pattern and the first sidewall spacers; and   forming the second sidewall spacers by anisotropically-etching the second insulating film.   
     
     
       17. The fabrication method of claim 10, wherein the first sidewall spacers have an etching selectivity from the second sidewall spacers. 
     
     
       18. The fabrication method of claim 13, wherein the transition metal is one of the group consisting of cobalt, molybdenum, tungsten and titanium. 
     
     
       19. The fabrication method of claim 13, wherein the step of ion-implantation of the transition metal is performed with a substrate temperature of approximately 300 to 400° C., a concentration of the transition metal of approximately 1-7×10 16  cm -2  and an ion-implantation energy of approximately 20-30 KeV.