Inventor · disambiguated record
Tzuen-Luh Huang
Also filed as: HUANG TZUEN-LUH
2 granted patents·2 pending applications·33 citations·filing 2004–2006
61Inventor score
Top patents by PatentIndex Score
4 records- 0179US7064446B2Under bump metallization layer to enable use of high tin content solder bumpsINTEL CORP·Filed 2004·Granted Jun 20, 2006·29 cites·6 claims
- 0261US7442634B2Method for constructing contact formationsINTEL CORP·Filed 2004·Granted Oct 28, 2008·4 cites·60 claims
- 0340US2005250323A1Under bump metallization layer to enable use of high tin content solder bumpsBARNAK JOHN P·Filed 2005·Application pending·0 cites
- 0436US2008079166A1Managing forces of semiconductor device layersLEE KEVIN J·Filed 2006·Application pending·0 cites
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