Inventor
ISHIWATA SHINICHI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “ISHIWATA SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FURUKAWA ELECTRIC CO LTD
8 patentsUS4999242AMar 12, 1991
Radiation-curable adhesive tape
FURUKAWA ELECTRIC CO LTD51 citations94
US5300172AApr 5, 1994
Surface-protection method during etching
FURUKAWA ELECTRIC CO LTD25 citations91
US5149586ASep 22, 1992
Radiation-curable adhesive tape
FURUKAWA ELECTRIC CO LTD27 citations90
USD628170SNov 30, 2010
Semiconductor wafer processing tape
FURUKAWA ELECTRIC CO LTD33 citations89
USD621803SAug 17, 2010
Semiconductor wafer processing tape
FURUKAWA ELECTRIC CO LTD33 citations89
US5538771AJul 23, 1996
Semiconductor wafer-securing adhesive tape
FURUKAWA ELECTRIC CO LTD33 citations87
US8043698B2Oct 25, 2011
Method of producing a semiconductor device, and wafer-processing tape
FURUKAWA ELECTRIC CO LTD9 citations80
US7413965B2Aug 19, 2008
Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape
FURUKAWA ELECTRIC CO LTD2 citations53