Inventor
HENG KOCK LIANG
SG10 patents
⚠️ This page may combine multiple inventors who share the name “HENG KOCK LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
5 patentsUS7838337B2Nov 23, 2010
Semiconductor device and method of forming an interposer package with through silicon vias
STATS CHIPPAC LTD166 citations98
US7741148B1Jun 22, 2010
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
STATS CHIPPAC LTD57 citations97
US9054083B2Jun 9, 2015
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
STATS CHIPPAC LTD4 citations83
US7880293B2Feb 1, 2011
Wafer integrated with permanent carrier and method therefor
STATS CHIPPAC LTD6 citations73
US8049328B2Nov 1, 2011
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
STATS CHIPPAC LTD2 citations62
MARIMUTHU PANDI CHELVAM
2 patentsUS8263439B2Sep 11, 2012
Semiconductor device and method of forming an interposer package with through silicon vias
MARIMUTHU PANDI CHELVAM91 citations96
US9029193B2May 12, 2015
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
MARIMUTHU PANDI CHELVAM4 citations71
SUTHIWONGSUNTHORN NATHAPONG
2 patentsUS8659162B2Feb 25, 2014
Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
SUTHIWONGSUNTHORN NATHAPONG19 citations90
US8067308B2Nov 29, 2011
Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support
SUTHIWONGSUNTHORN NATHAPONG28 citations90