Inventor
OHASHI TOYO
JP10 patents
Patents
10 patentsUS10798824B2Oct 6, 2020
Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module
MITSUBISHI MATERIALS CORP3 citations71
US9953944B2Apr 24, 2018
Power module
MITSUBISHI MATERIALS CORP3 citations71
US11222835B2Jan 11, 2022
Insulating circuit substrate and method for producing insulating circuit substrate
MITSUBISHI MATERIALS CORP2 citations67
US12068219B2Aug 20, 2024
Heat sink integrated insulating circuit board
MITSUBISHI MATERIALS CORP0 citations57
US12137526B2Nov 5, 2024
Bonded body and insulating circuit board
MITSUBISHI MATERIALS CORP0 citations56
US10453783B2Oct 22, 2019
Power module substrate
MITSUBISHI MATERIALS CORP0 citations50
US12177962B2Dec 24, 2024
Insulating resin circuit substrate
MITSUBISHI MATERIALS CORP0 citations46
US12133338B2Oct 29, 2024
Insulated circuit substrate manufacturing method
MITSUBISHI MATERIALS CORP0 citations46
US12108528B2Oct 1, 2024
Insulating circuit board
MITSUBISHI MATERIALS CORP0 citations46
US12563666B2Feb 24, 2026
Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method
MITSUBISHI MATERIALS CORP0 citations45