Inventor

LEE TEAK HOON

KR25 patents

⚠️ This page may combine multiple inventors who share the name “LEE TEAK HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TEAK HOON

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages and methods of fabricating the same

Semiconductor package having recessed adhesive layer between stacked chips

Semiconductor package and method for fabricating the same

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor packages having TSV and adhesive layer

Semiconductor package and electronic device having the same

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Semiconductor package

Semiconductor package

Method of manufacturing chip-stacked semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Method of cutting substrate and method of singulating semiconductor chips

Semiconductor package with increased thermal radiation efficiency

Semiconductor package

Substrate of semiconductor package and method of fabricating semiconductor package using the same

Substrate of semiconductor package and method of fabricating semiconductor package using the same

LEE TEAK-HOON

Method of fabricating stacked chips in a semiconductor package

Stacked chips in a semiconductor package

KIM PYOUNG-WAN

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Semiconductor package having buried post in encapsulant and method of manufacturing the same

AHN JUNG-SEOK

Method of manufacturing chip-stacked semiconductor package

JANG CHUL-YONG

Semiconductor package and methods of manufacturing the semiconductor package