Inventor · disambiguated record
Yuan-Fu Lan
Also filed as: Lan yuan-fu
5 granted patents·4 pending applications·10 citations·filing 2016–2019
70Inventor score
Files withPOWERTECH TECHNOLOGY INC9
Top patents by PatentIndex Score
9 records- 0187US10224254B2Package process method including disposing a die within a recess of a one-piece materialPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Mar 5, 2019·6 cites·20 claims
- 0274US11024603B2Manufacturing method and a related stackable chip packagePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·2 cites·6 claims
- 0369US10354978B1Stacked package including exterior conductive element and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jul 16, 2019·1 cites·9 claims
- 0467US10892250B2Stacked package structure with encapsulation and redistribution layer and fabricating method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jan 12, 2021·1 cites·8 claims
- 0555US2018114782A1Manufacturing method of package-on-package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 0638US2019252325A1Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0737US2019214367A1Stacked package and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0836US9659884B2Carrier substratePOWERTECH TECHNOLOGY INC·Filed 2016·Granted May 23, 2017·0 cites·17 claims
- 0933US2017047277A1Semiconductor structurePOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →