Manufacturing method of package-on-package structure

Abstract

A manufacturing method of a package-on package structure including at least the following steps is provided. A die is bonded on a first circuit carrier. A spacer is disposed on the die. The spacer and the first circuit carrier are connected through a plurality of conductive wires. An encapsulant is formed to encapsulate the die, the spacer and the conductive wires. A thickness of the encapsulant is reduced until at least a portion of each of the conductive wires is removed to form a first package structure. A second package structure is stacked on the first package structure. The second package structure is electrically connected to the conductive wires.

What is claimed is: 
     
         1 . A manufacturing method of a package-on-package (POP) structure, comprising:
 bonding a die on a first circuit carrier;   disposing a spacer on the die;   connecting the spacer and the first circuit carrier through a plurality of conductive wires;   forming an encapsulant to encapsulate the die, the spacer and the conductive wires;   reducing a thickness of the encapsulant until at least a portion of each of the conductive wires are removed to form a first package structure; and   stacking a second package structure on the first package structure, wherein the second package structure is electrically connected to the conductive wires.   
     
     
         2 . The manufacturing method of a POP structure according to  claim 1 , wherein the die is electrically connected to the first circuit carrier through flip-chip bonding. 
     
     
         3 . The manufacturing method of a POP structure according to  claim 1 , wherein the spacer is bonded to the die through an adhesive layer. 
     
     
         4 . The manufacturing method of a POP structure according to  claim 1 , wherein the conductive wires are formed through a wire bonder. 
     
     
         5 . The manufacturing method of a POP structure according to  claim 1 , wherein the spacer comprises a second circuit carrier, the conductive wires are connected between the second circuit carrier and the first circuit canier before reducing the thickness of the encapsulant. 
     
     
         6 . The manufacturing method of a POP structure according to  claim 5 , wherein each of the conductive wires comprises a first welding segment connected to the first circuit carrier and a second welding segment connected to the spacer before reducing the thickness of the encapsulant, the conductive wires are connected from the first circuit carrier through the first welding segments to the spacer through the second welding segments. 
     
     
         7 . The manufacturing method of a POP structure according to  claim 6 , wherein an angle between the first welding segment of each of the conductive wires and the first circuit carrier is greater than an angle between the second welding segment of each of the conductive wires and the spacer before reducing the thickness of the encapsulant. 
     
     
         8 . The manufacturing method of a POP structure according to  claim 6 , wherein each of the conductive wires further comprises a sacrificial segment connecting between the first welding segment and the second welding segment before reducing the thickness of the encapsulant, when reducing the thickness of the encapsulant, the sacrificial segments of the conductive wires are removed. 
     
     
         9 . The manufacturing method of a POP structure according to  claim 8 , wherein after reducing the thickness of the encapsulant, a portion of each of the first welding segments of the conductive wires and a portion of each of the second welding segments of the conductive wires are exposed by the encapsulant. 
     
     
         10 . The manufacturing method of a POP structure according to  claim 8 , wherein after the sacrificial segments of the conductive wires are removed, the spacer is electrically floated. 
     
     
         11 . The manufacturing method of a POP structure according to  claim 8 , wherein the second package structure comprises a plurality of conductive terminals, each of the conductive terminals of the second package structure is disposed on one of the first welding segments of the conductive wires exposed by the encapsulant respectively. 
     
     
         12 . The manufacturing method of a POP structure according to  claim 1 , wherein the spacer comprises a conductive plate. 
     
     
         13 . The manufacturing method of a POP structure according to  claim 12 , wherein the spacer is bonded to the die through a thermal adhesive layer. 
     
     
         14 . The manufacturing method of a POP structure according to  claim 12 , wherein after reducing the thickness of the encapsulant, a surface of the spacer is exposed from the encapsulant. 
     
     
         15 . The manufacturing method of a POP structure according to  claim 12 , wherein each of the conductive wires comprises a welding segment connected to the first circuit carrier and a sacrificial segment connected between the welding segment and the spacer before reducing the thickness of the encapsulant, the conductive wires are connected from the first circuit carrier through the welding segment to the spacer through the sacrificial segment. 
     
     
         16 . The manufacturing method of a POP structure according to  claim 15 , wherein an angle between the welding segment of each of the conductive wires and the first circuit carrier is greater than an angle between the sacrificial segment of each of the conductive wires and the spacer before reducing the thickness of the encapsulant. 
     
     
         17 . The manufacturing method of a POP structure according to  claim 15 , wherein when reducing the thickness of the encapsulant, the sacrificial segments of the conductive wires are removed. 
     
     
         18 . The manufacturing method of a POP structure according to  claim 15 , wherein after reducing the thickness of the encapsulant, a portion of each of the welding segments of the conductive wires are exposed by the encapsulant. 
     
     
         19 . The manufacturing method of a POP structure according to  claim 15 , wherein after the sacrificial segments of the conductive wires are removed, the spacer is electrically floated. 
     
     
         20 . The manufacturing method of a POP structure according to  claim 15 , wherein the second package structure comprises a plurality of conductive terminals, each of the conductive terminals of the second package structure is disposed on one of the welding segments exposed by the encapsulant respectively.