Inventor · disambiguated record

Hung-Hsin Hsu

Also filed as: HSU HUNG-HSIN

80 granted patents·31 pending applications·233 citations·filing 2007–2024

98Inventor score

Technology areasH10W H10P H01L B01F B05B

Files withPOWERTECH TECHNOLOGY INC95 ASIA IC MIC PROCESS INC10 HSU HUNG-HSIN5 MACROTECH TECHNOLOGY INC1

Top patents by PatentIndex Score

111 records

0198US10157828B2Chip package structure with conductive pillar and a manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Dec 18, 2018·53 cites·14 claims
0296US11127699B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 21, 2021·4 cites·18 claims
0395US11569210B2Package structure having a first connection circuit and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Jan 31, 2023·4 cites·19 claims
0492US10515936B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Dec 24, 2019·10 cites·8 claims
0592US7902666B1Flip chip device having soldered metal posts by surface mountingPOWERTECH TECHNOLOGY INC·Filed 2009·Granted Mar 8, 2011·52 cites·20 claims
0689US11309283B2Packaging structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·2 cites·14 claims
0789US10079218B1Test method for a redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Sep 18, 2018·7 cites·20 claims
0887US10224254B2Package process method including disposing a die within a recess of a one-piece materialPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Mar 5, 2019·6 cites·20 claims
0987US9825005B2Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Nov 21, 2017·7 cites·6 claims
1087US8115319B2Flip chip package maintaining alignment during solderingHSU HUNG-HSIN·Filed 2010·Granted Feb 14, 2012·15 cites·9 claims
1186US10593647B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 17, 2020·4 cites·9 claims
1285US11309296B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 19, 2022·4 cites·13 claims
1385US8237273B2Metal post chip connecting device and method free to use soldering materialHSU HUNG-HSIN·Filed 2010·Granted Aug 7, 2012·11 cites·10 claims
1484US10141276B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 27, 2018·3 cites·9 claims
1583US10796931B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Oct 6, 2020·3 cites·15 claims
1683US10512890B1Apparatus for mixing materials which have a high mix proportion/ratio therebetween and preparation production system using the sameASIA IC MIC PROCESS INC·Filed 2019·Granted Dec 24, 2019·2 cites·19 claims
1782US10950593B2Package structure including at least one connecting module and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 16, 2021·3 cites·13 claims
1880US10978408B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 13, 2021·3 cites·13 claims
1980US10269671B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 23, 2019·3 cites·20 claims
2078US11088100B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
2178US10332844B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 25, 2019·2 cites·10 claims
2278US8048721B2Method for filling multi-layer chip-stacked gapsPOWERTECH TECHNOLOGY INC·Filed 2010·Granted Nov 1, 2011·5 cites·8 claims
2376US10629559B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 21, 2020·2 cites·10 claims
2474US11024603B2Manufacturing method and a related stackable chip packagePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·2 cites·6 claims
2574US10276526B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 30, 2019·1 cites·11 claims
2673US11557533B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jan 17, 2023·0 cites·16 claims
2773US11456243B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
2873US11211321B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
2973US11097906B1Liquid withdrawal systemASIA IC MIC PROCESS INC·Filed 2020·Granted Aug 24, 2021·1 cites·8 claims
3073US10170458B2Manufacturing method of package-on-package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jan 1, 2019·1 cites·18 claims
3172US11545424B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
3272US11532575B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 20, 2022·1 cites·19 claims
3372US11367678B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·0 cites·16 claims
3470US10840200B2Manufacturing method of chip package structure comprising encapsulant having concave surfacePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
3570US10002848B1Test method for a redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·1 cites·22 claims
3669US10629554B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 21, 2020·1 cites·7 claims
3769US10354978B1Stacked package including exterior conductive element and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jul 16, 2019·1 cites·9 claims
3868US11088080B2Chip package structure using silicon interposer as interconnection bridgePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·1 cites·10 claims
3968US10862202B1Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 8, 2020·1 cites·20 claims
4067US10892250B2Stacked package structure with encapsulation and redistribution layer and fabricating method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jan 12, 2021·1 cites·8 claims
4167US7605462B2Universal substrate for a semiconductor device having selectively activated fusesPOWERTECH TECHNOLOGY INC·Filed 2007·Granted Oct 20, 2009·4 cites·7 claims
4266US10438931B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 8, 2019·1 cites·13 claims
4365US9991206B1Package method including forming electrical paths through a mold layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
4464US11911782B2Nozzle flow stirring pipeASIA IC MIC PROCESS INC·Filed 2021·Granted Feb 27, 2024·0 cites·10 claims
4563US7663204B2Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applicationsPOWERTECH TECHNOLOGY INC·Filed 2007·Granted Feb 16, 2010·2 cites·18 claims
4662US11296041B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 5, 2022·0 cites·8 claims
4761US10249585B2Stackable semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Apr 2, 2019·1 cites·19 claims
4859US10756065B2Method thereof of package structurePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 25, 2020·0 cites·16 claims
4958US12400979B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Granted Aug 26, 2025·0 cites·17 claims
5057US10276553B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·0 cites·18 claims

Showing the top 50 of 111 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →