Inventor
LIU YUFU
CN9 patents
⚠️ This page may combine multiple inventors who share the name “LIU YUFU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
6 patentsUS11640947B2May 2, 2023
Pre-resist island forming via method and apparatus
NXP BV2 citations68
US12406951B2Sep 2, 2025
Redistribution layer having a sideview zig-zag profile
NXP BV0 citations59
US12198998B2Jan 14, 2025
Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process
NXP BV0 citations58
US11935753B2Mar 19, 2024
Backside and sidewall metallization of semiconductor devices
NXP BV0 citations58
US12080601B2Sep 3, 2024
Packaged semiconductor devices and methods therefor
NXP BV0 citations49
US12494448B2Dec 9, 2025
UBM-free metal skeleton frame with support studs and method for fabrication thereof
NXP BV0 citations47