Inventor · disambiguated record
Yonggill Lee
Also filed as: LEE YONGGILL
3 granted patents·2 pending applications·464 citations·filing 2006–2007
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0194US7242081B1Stacked package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 10, 2007·413 cites·10 claims
- 0292US7408244B2Semiconductor package and stack arrangement thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 5, 2008·46 cites·9 claims
- 0364US7456053B2Packaging method for segregating die paddles of a leadframeADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 25, 2008·5 cites·20 claims
- 0445US2007254406A1Method for manufacturing stacked package structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0534US2006255449A1Lid used in package structure and the package structure having the sameLEE YONGGILL·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →