Inventor
PARK YOUNG-LIM
KR42 patents
⚠️ This page may combine multiple inventors who share the name “PARK YOUNG-LIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
31 patentsUS7943502B2May 17, 2011
Method of forming a phase change memory device
SAMSUNG ELECTRONICS CO LTD26 citations92
US7727884B2Jun 1, 2010
Methods of forming a semiconductor device including a phase change material layer
SAMSUNG ELECTRONICS CO LTD19 citations92
US7569417B2Aug 4, 2009
Method of forming a phase changeable material layer, a method of manufacturing a phase changeable memory unit, and a method of manufacturing a phase changeable semiconductor memory device
SAMSUNG ELECTRONICS CO LTD38 citations92
US7824954B2Nov 2, 2010
Methods of forming phase change memory devices having bottom electrodes
SAMSUNG ELECTRONICS CO LTD21 citations91
US8034683B2Oct 11, 2011
Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed
SAMSUNG ELECTRONICS CO LTD8 citations83
US7759667B2Jul 20, 2010
Phase change memory device including resistant material
SAMSUNG ELECTRONICS CO LTD17 citations83
US10453913B2Oct 22, 2019
Capacitor, semiconductor device and methods of manufacturing the capacitor and the semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations82
US11488958B2Nov 1, 2022
Semiconductor device electrodes including fluorine
SAMSUNG ELECTRONICS CO LTD2 citations72
US11244946B2Feb 8, 2022
Semiconductor devices and methods for fabricating thereof
SAMSUNG ELECTRONICS CO LTD2 citations72
US10892345B2Jan 12, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US10825893B2Nov 3, 2020
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD5 citations72
US11233118B2Jan 25, 2022
Integrated circuit device having dielectric layer, and method and apparatus for manufacturing the integrated circuit device
SAMSUNG ELECTRONICS CO LTD3 citations71
US11133314B2Sep 28, 2021
Semiconductor memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US11069768B2Jul 20, 2021
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US10847603B2Nov 24, 2020
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US10658454B2May 19, 2020
Capacitor, semiconductor device and methods of manufacturing the capacitor and the semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US7803654B2Sep 28, 2010
Variable resistance non-volatile memory cells and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD6 citations63
US7867880B2Jan 11, 2011
Metal precursors for low temperature deposition and methods of forming a metal thin layer and manufacturing a phase-change memory device using the metal precursors
SAMSUNG ELECTRONICS CO LTD6 citations62
US12089397B2Sep 10, 2024
Semiconductor devices and methods for fabricating thereof
SAMSUNG ELECTRONICS CO LTD0 citations61
US11764283B2Sep 19, 2023
Semiconductor device including capacitor
SAMSUNG ELECTRONICS CO LTD0 citations61
US11711915B2Jul 25, 2023
Semiconductor devices and methods for fabricating thereof
SAMSUNG ELECTRONICS CO LTD0 citations61
US11621339B2Apr 4, 2023
Semiconductor device including capacitor
SAMSUNG ELECTRONICS CO LTD0 citations61
US11527604B2Dec 13, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11114541B2Sep 7, 2021
Semiconductor device including capacitor
SAMSUNG ELECTRONICS CO LTD0 citations61
US11600621B2Mar 7, 2023
Semiconductor memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US7807497B2Oct 5, 2010
Phase-change material layers, methods of forming the same, phase-change memory devices having the same, and methods of forming phase-change memory devices
SAMSUNG ELECTRONICS CO LTD5 citations58
US12080710B2Sep 3, 2024
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations55
US8021977B2Sep 20, 2011
Methods of forming contact structures and semiconductor devices fabricated using contact structures
SAMSUNG ELECTRONICS CO LTD0 citations52
US9685318B2Jun 20, 2017
Method of forming semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations48
US12471300B2Nov 11, 2025
Capacitor structure, semiconductor memory device including the structure, and method for manufacturing the structure
SAMSUNG ELECTRONICS CO LTD0 citations47
US7855145B2Dec 21, 2010
Gap filling method and method for forming semiconductor memory device using the same
SAMSUNG ELECTRONICS CO LTD0 citations41
OH GYUHWAN
3 patentsUS8278206B2Oct 2, 2012
Variable resistance memory device and methods of forming the same
OH GYUHWAN12 citations82
US8558348B2Oct 15, 2013
Variable resistance memory device and methods of forming the same
OH GYUHWAN5 citations71
US8501623B2Aug 6, 2013
Method of forming a semiconductor device having a metal silicide and alloy layers as electrode
OH GYUHWAN6 citations70
PARK YOUNG-LIM
3 patentsUS8263455B2Sep 11, 2012
Method of forming variable resistance memory device
PARK YOUNG-LIM13 citations81
US8263963B2Sep 11, 2012
Phase change memory device
PARK YOUNG-LIM3 citations61
US8389408B2Mar 5, 2013
Methods of forming a semiconductor device including a metal silicon nitride layer
PARK YOUNG-LIM0 citations38