P

Inventor

PARK YOUNG-LIM

KR42 patents
⚠️ This page may combine multiple inventors who share the name “PARK YOUNG-LIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

31 patents
US7943502B2May 17, 2011

Method of forming a phase change memory device

SAMSUNG ELECTRONICS CO LTD26 citations92
US7727884B2Jun 1, 2010

Methods of forming a semiconductor device including a phase change material layer

SAMSUNG ELECTRONICS CO LTD19 citations92
US7569417B2Aug 4, 2009

Method of forming a phase changeable material layer, a method of manufacturing a phase changeable memory unit, and a method of manufacturing a phase changeable semiconductor memory device

SAMSUNG ELECTRONICS CO LTD38 citations92
US7824954B2Nov 2, 2010

Methods of forming phase change memory devices having bottom electrodes

SAMSUNG ELECTRONICS CO LTD21 citations91
US8034683B2Oct 11, 2011

Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed

SAMSUNG ELECTRONICS CO LTD8 citations83
US7759667B2Jul 20, 2010

Phase change memory device including resistant material

SAMSUNG ELECTRONICS CO LTD17 citations83
US10453913B2Oct 22, 2019

Capacitor, semiconductor device and methods of manufacturing the capacitor and the semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations82
US11488958B2Nov 1, 2022

Semiconductor device electrodes including fluorine

SAMSUNG ELECTRONICS CO LTD2 citations72
US11244946B2Feb 8, 2022

Semiconductor devices and methods for fabricating thereof

SAMSUNG ELECTRONICS CO LTD2 citations72
US10892345B2Jan 12, 2021

Semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations72
US10825893B2Nov 3, 2020

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD5 citations72
US11233118B2Jan 25, 2022

Integrated circuit device having dielectric layer, and method and apparatus for manufacturing the integrated circuit device

SAMSUNG ELECTRONICS CO LTD3 citations71
US11133314B2Sep 28, 2021

Semiconductor memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations71
US11069768B2Jul 20, 2021

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD3 citations71
US10847603B2Nov 24, 2020

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD5 citations71
US10658454B2May 19, 2020

Capacitor, semiconductor device and methods of manufacturing the capacitor and the semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations71
US7803654B2Sep 28, 2010

Variable resistance non-volatile memory cells and methods of fabricating same

SAMSUNG ELECTRONICS CO LTD6 citations63
US7867880B2Jan 11, 2011

Metal precursors for low temperature deposition and methods of forming a metal thin layer and manufacturing a phase-change memory device using the metal precursors

SAMSUNG ELECTRONICS CO LTD6 citations62
US12089397B2Sep 10, 2024

Semiconductor devices and methods for fabricating thereof

SAMSUNG ELECTRONICS CO LTD0 citations61
US11764283B2Sep 19, 2023

Semiconductor device including capacitor

SAMSUNG ELECTRONICS CO LTD0 citations61
US11711915B2Jul 25, 2023

Semiconductor devices and methods for fabricating thereof

SAMSUNG ELECTRONICS CO LTD0 citations61
US11621339B2Apr 4, 2023

Semiconductor device including capacitor

SAMSUNG ELECTRONICS CO LTD0 citations61
US11527604B2Dec 13, 2022

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US11114541B2Sep 7, 2021

Semiconductor device including capacitor

SAMSUNG ELECTRONICS CO LTD0 citations61
US11600621B2Mar 7, 2023

Semiconductor memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US7807497B2Oct 5, 2010

Phase-change material layers, methods of forming the same, phase-change memory devices having the same, and methods of forming phase-change memory devices

SAMSUNG ELECTRONICS CO LTD5 citations58
US12080710B2Sep 3, 2024

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations55
US8021977B2Sep 20, 2011

Methods of forming contact structures and semiconductor devices fabricated using contact structures

SAMSUNG ELECTRONICS CO LTD0 citations52
US9685318B2Jun 20, 2017

Method of forming semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations48
US12471300B2Nov 11, 2025

Capacitor structure, semiconductor memory device including the structure, and method for manufacturing the structure

SAMSUNG ELECTRONICS CO LTD0 citations47
US7855145B2Dec 21, 2010

Gap filling method and method for forming semiconductor memory device using the same

SAMSUNG ELECTRONICS CO LTD0 citations41

OH GYUHWAN

3 patents

PARK YOUNG-LIM

3 patents

OH GYU-HWAN

2 patents

AN HYEONG-GEUN

1 patent

KIM YOUNGKUK

1 patent

LEE JIN-IL

1 patent