Inventor

MATSUO MIE

JP58 patents

⚠️ This page may combine multiple inventors who share the name “MATSUO MIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUO MIE

TOSHIBA KK

Electronic component having micro-electrical mechanical system

Multichip semiconductor device, chip therefor and method of formation thereof

Semiconductor substrate having pillars within a closed empty space

Stacked type semiconductor device

Passive semiconductor device mounted as daughter chip on active semiconductor device

Polishing method and polishing apparatus

Semiconductor device having a metal film formed in a groove in an insulating film

Polishing method and polishing apparatus

Stacked type semiconductor device

Method of making empty space in silicon

Semiconductor device and method of manufacturing the same

Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide

Multichip semiconductor device, chip therefor and method of formation thereof

Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment

Multichip semiconductor device, chip therefor and method of formation thereof

Stacked type semiconductor device

Semiconductor package including through-hole electrode and light-transmitting substrate

Semiconductor device having actuator

Semiconductor device, semiconductor package member, and semiconductor device manufacturing method

Stacked type semiconductor device

Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device

Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide

Semiconductor device and semiconductor memory tester

Semiconductor device

Heating element movement bonding method for semiconductor components

Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device

Semiconductor device

Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device

Integrated circuit device and method of manufacturing the same

Semiconductor device

Back-illuminated type solid-state image pickup device and camera module using the same

Method for fabricating semiconductor device

Semiconductor device having power semiconductor elements

Electronic component having micro-electrical mechanical system

Semiconductor device

KIOXIA CORP

Memory system

Semiconductor device, method of manufacturing semiconductor device, and method of recycling substrate

Semiconductor device manufacturing method and semiconductor device

Semiconductor device, method of manufacturing semiconductor device, and method of recycling substrate

Manufacturing method of semiconductor device

Semiconductor memory device having a circuit chip bonded to a memory array chip and including a solid-state drive controller and a control circuit

Semiconductor memory device including integrated control circuit and solid-state drive controller

HAYASAKA NOBUO

Multichip semiconductor device, chip therefor and method of formation thereof

Multichip semiconductor device, chip therefor and method of formation thereof

TOSHIBA MEMORY CORP

Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuit

Semiconductor device manufacturing method and semiconductor device

MATSUO MIE

Semiconductor package and camera module

Back-illuminated type solid-state image pickup apparatus with peripheral circuit unit

SHIMIZU YUUI

Semiconductor device and semiconductor memory tester

TANIDA KAZUMASA

Semiconductor device, through hole having expansion portion and thin insulating film