Inventor · disambiguated record

Lai Wa Helen Chan

Also filed as: CHAN LAI WA HELEN

1 granted patent·9 citations·filing 2004–2004

31Inventor score

Technology areasH10P

Files withASM ASSEMBLY AUTOMATION LTD1

Top patents by PatentIndex Score

1 record

0157US7240711B2Apparatus and method for alignment of a bonding toolASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jul 10, 2007·9 cites·15 claims

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