Inventor
LO CHIN-YUAN
TW6 patents
Patents
6 patentsUS11322474B2May 3, 2022
Semiconductor package
REALTEK SEMICONDUCTOR CORP2 citations69
US11264352B2Mar 1, 2022
Electronic package structure with a core ground wire and chip thereof
REALTEK SEMICONDUCTOR CORP0 citations60
US10998016B2May 4, 2021
Memory device including noise-suppressing mechanism
REALTEK SEMICONDUCTOR CORP0 citations57
US11553585B2Jan 10, 2023
Circuit board and electronic apparatus using the same
REALTEK SEMICONDUCTOR CORP0 citations55
US11227854B2Jan 18, 2022
Semiconductor package
REALTEK SEMICONDUCTOR CORP0 citations49
US9955586B2Apr 24, 2018
Ball grid array formed on printed circuit board
REALTEK SEMICONDUCTOR CORP0 citations38