Inventor
TEMPLETON JR THOMAS H
US15 patents
⚠️ This page may combine multiple inventors who share the name “TEMPLETON JR THOMAS H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
US3 INC
8 patentsUS5682296AOct 28, 1997
Plastic integrated circuit card with reinforcement structure located over integrated circuit module for protecting same
US3 INC35 citations95
US5673179ASep 30, 1997
Plastic integrated circuit card with reinforcement structure outer to the card and protecting integrated circuit module
US3 INC27 citations95
US5581445ADec 3, 1996
Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
US3 INC35 citations95
US5519201AMay 21, 1996
Electrical interconnection for structure including electronic and/or electromagnetic devices
US3 INC66 citations95
US5682294AOct 28, 1997
Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module
US3 INC19 citations92
US6058017AMay 2, 2000
Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module
US3 INC14 citations81
US5682295AOct 28, 1997
Plastic integrated circuit card with reinforcement structure separated from integrated circuit module by card
US3 INC9 citations81
US5682293AOct 28, 1997
Integrated circuit card having a reinforcement structure and an integrated circuit module disposed on opposing surfaces
US3 INC5 citations73
INTEGRATED DEVICE TECH
5 patentsUSRE36907EOct 10, 2000
Leadframe with power and ground planes
INTEGRATED DEVICE TECH121 citations98
US5457340AOct 10, 1995
Leadframe with power and ground planes
INTEGRATED DEVICE TECH118 citations98
US5448165ASep 5, 1995
Electrically tested and burned-in semiconductor die and method for producing same
INTEGRATED DEVICE TECH88 citations94
US5874321AFeb 23, 1999
Package integrated circuit having thermal enhancement and reduced footprint size
INTEGRATED DEVICE TECH37 citations91
US5766975AJun 16, 1998
Packaged integrated circuit having thermal enhancement and reduced footprint size
INTEGRATED DEVICE TECH21 citations91