Inventor
SHAW JANE MARGARET
US27 patents
Patents
27 patentsUS6184121B1Feb 6, 2001
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM369 citations98
US6577011B1Jun 10, 2003
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM86 citations97
US6097019AAug 1, 2000
Radiation control system
IBM58 citations96
US5997773ADec 7, 1999
Method for providing discharge protection or shielding
IBM30 citations96
US5922466AJul 13, 1999
Composite comprising a metal substrate and a corrosion protecting layer
IBM41 citations96
US5776587AJul 7, 1998
Electronic package comprising a substrate and a semiconductor device bonded thereto
IBM30 citations96
US5700398ADec 23, 1997
Composition containing a polymer and conductive filler and use thereof
IBM42 citations96
US5817986AOct 6, 1998
Three dimensional package and architecture for high performance computer
IBM46 citations95
US6149840ANov 21, 2000
Electrically conductive polymeric materials and use thereof
IBM45 citations93
US5659153AAug 19, 1997
Thermoformed three dimensional wiring module
IBM20 citations93
US6437422B1Aug 20, 2002
Active devices using threads
IBM46 citations92
US6268238B1Jul 31, 2001
Three dimensional package and architecture for high performance computer
IBM20 citations92
US6015509AJan 18, 2000
Composition containing a polymer and conductive filler and use thereof
IBM19 citations92
US5985458ANov 16, 1999
Housing for electromagnetic interference shielding
IBM24 citations92
US5916486AJun 29, 1999
Method for providing discharge protection or shielding
IBM20 citations92
US5837978ANov 17, 1998
Radiation control system
IBM41 citations91
US6746770B1Jun 8, 2004
Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof
IBM30 citations87
US5935687AAug 10, 1999
Three dimensional package and architecture for high performance computer
IBM15 citations81
US6414377B1Jul 2, 2002
Low k dielectric materials with inherent copper ion migration barrier
IBM10 citations74
US6139778AOct 31, 2000
Vibrational methods of deaggregation of electrically conductive polymers and precursors thereof
IBM7 citations74
US6099756AAug 8, 2000
Vibrational methods of deaggregation of electrically conductive polymers and precursors thereof
IBM7 citations74
US6168732B1Jan 2, 2001
Electrically conductive polymeric materials and use thereof
IBM12 citations71
US6730618B2May 4, 2004
Low k dielectric materials with inherent copper ion migration barrier
IBM3 citations63
US6017682AJan 25, 2000
Solid state extension method
IBM4 citations63
US7585431B1Sep 8, 2009
Electrically conductive polymeric materials and use thereof
IBM4 citations60
US6013414AJan 11, 2000
Photosensitive polyimide-precursor formulation
IBM2 citations58
US6010832AJan 4, 2000
Photosensitive polyimide-precursor formulation
IBM2 citations58