Inventor
ROLDAN JUDITH MARIE
US20 patents
⚠️ This page may combine multiple inventors who share the name “ROLDAN JUDITH MARIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS6005292ADec 21, 1999
Lead-free interconnection for electronic devices
IBM68 citations96
US5997773ADec 7, 1999
Method for providing discharge protection or shielding
IBM30 citations96
US5922466AJul 13, 1999
Composite comprising a metal substrate and a corrosion protecting layer
IBM41 citations96
US5776587AJul 7, 1998
Electronic package comprising a substrate and a semiconductor device bonded thereto
IBM30 citations96
US5700398ADec 23, 1997
Composition containing a polymer and conductive filler and use thereof
IBM42 citations96
US5813870ASep 29, 1998
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
IBM55 citations94
US6197222B1Mar 6, 2001
Lead free conductive composites for electrical interconnections
IBM22 citations92
US6127253AOct 3, 2000
Lead-free interconnection for electronic devices
IBM26 citations92
US6015509AJan 18, 2000
Composition containing a polymer and conductive filler and use thereof
IBM19 citations92
US6013713AJan 11, 2000
Electrode modification using an unzippable polymer paste
IBM18 citations92
US5985458ANov 16, 1999
Housing for electromagnetic interference shielding
IBM24 citations92
US5916486AJun 29, 1999
Method for providing discharge protection or shielding
IBM20 citations92
US5897336AApr 27, 1999
Direct chip attach for low alpha emission interconnect system
IBM42 citations92
US5866044AFeb 2, 1999
Lead free conductive composites for electrical interconnections
IBM32 citations92
US6099939AAug 8, 2000
Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
IBM35 citations89
US6174606B1Jan 16, 2001
Corrosion and dissolution protection of a conductive silver/polymer composite
IBM25 citations88
US6281105B1Aug 28, 2001
Electrode modification using an unzippable polymer paste
IBM14 citations82
US6221503B1Apr 24, 2001
Electrode modification using an unzippable polymer paste
IBM5 citations74
US5834405ANov 10, 1998
Superconducting multilayer ceramic substrate
IBM5 citations58