Inventor
WALD PHILLIP G
US63 patents
Patents
50 patentsUS6306705B1Oct 23, 2001
Methods of forming capacitors, DRAM arrays, and monolithic integrated circuits
MICRON TECHNOLOGY INC253 citations99
US5238862AAug 24, 1993
Method of forming a stacked capacitor with striated electrode
MICRON TECHNOLOGY INC268 citations99
US6781867B2Aug 24, 2004
Embedded ROM device using substrate leakage
MICRON TECHNOLOGY INC44 citations96
US6710390B2Mar 23, 2004
Capacitors and DRAM arrays
MICRON TECHNOLOGY INC37 citations96
US6545899B1Apr 8, 2003
ROM embedded DRAM with bias sensing
MICRON TECHNOLOGY INC53 citations96
US6207523B1Mar 27, 2001
Methods of forming capacitors DRAM arrays, and monolithic integrated circuits
MICRON TECHNOLOGY INC29 citations96
US6180485B1Jan 30, 2001
Methods of forming capacitors, DRAM arrays, and monolithic integrated circuits
MICRON TECHNOLOGY INC29 citations96
US5895274AApr 20, 1999
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC38 citations96
US5739068AApr 14, 1998
Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material
MICRON TECHNOLOGY INC51 citations96
US5300801AApr 5, 1994
Stacked capacitor construction
MICRON TECHNOLOGY INC67 citations96
US6281131B1Aug 28, 2001
Methods of forming electrical contacts
MICRON TECHNOLOGY INC63 citations94
US6407455B1Jun 18, 2002
Local interconnect using spacer-masked contact etch
MICRON TECHNOLOGY INC20 citations93
USRE37505EJan 15, 2002
Stacked capacitor construction
MICRON TECHNOLOGY INC17 citations93
US6107189AAug 22, 2000
Method of making a local interconnect using spacer-masked contact etch
MICRON TECHNOLOGY INC30 citations93
US5932491AAug 3, 1999
Reduction of contact size utilizing formation of spacer material over resist pattern
MICRON TECHNOLOGY INC41 citations93
US6785167B2Aug 31, 2004
ROM embedded DRAM with programming
MICRON TECHNOLOGY INC22 citations92
US6002623ADec 14, 1999
Semiconductor memory with test circuit
MICRON TECHNOLOGY INC39 citations91
US5684809ANov 4, 1997
Semiconductor memory with test circuit
MICRON TECHNOLOGY INC24 citations91
US7366946B2Apr 29, 2008
ROM redundancy in ROM embedded DRAM
MICRON TECHNOLOGY INC11 citations84
US7218547B2May 15, 2007
ROM embedded DRAM with anti-fuse programming
MICRON TECHNOLOGY INC11 citations84
US7174477B2Feb 6, 2007
ROM redundancy in ROM embedded DRAM
MICRON TECHNOLOGY INC11 citations84
US6735108B2May 11, 2004
ROM embedded DRAM with anti-fuse programming
MICRON TECHNOLOGY INC14 citations84
US6665207B2Dec 16, 2003
ROM embedded DRAM with dielectric removal/short
MICRON TECHNOLOGY INC14 citations84
US6996021B2Feb 7, 2006
ROM embedded DRAM with bias sensing
MICRON TECHNOLOGY INC9 citations82
US6737730B1May 18, 2004
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC12 citations82
US6703325B1Mar 9, 2004
High pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC7 citations82
US6387828B1May 14, 2002
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC11 citations82
US6352946B1Mar 5, 2002
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC9 citations82
US6865100B2Mar 8, 2005
6F2 architecture ROM embedded DRAM
MICRON TECHNOLOGY INC6 citations74
US6852611B2Feb 8, 2005
ROM embedded DRAM with dielectric removal/short
MICRON TECHNOLOGY INC5 citations74
US6788603B2Sep 7, 2004
ROM embedded DRAM with bias sensing
MICRON TECHNOLOGY INC3 citations74
US6753617B2Jun 22, 2004
Method for improving a stepper signal in a planarized surface over alignment topography
MICRON TECHNOLOGY INC6 citations74
US6747889B2Jun 8, 2004
Half density ROM embedded DRAM
MICRON TECHNOLOGY INC8 citations74
US6731556B2May 4, 2004
DRAM with bias sensing
MICRON TECHNOLOGY INC7 citations74
US6670289B2Dec 30, 2003
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC4 citations74
US6501188B1Dec 31, 2002
Method for improving a stepper signal in a planarized surface over alignment topography
MICRON TECHNOLOGY INC5 citations74
US6455400B1Sep 24, 2002
Semiconductor processing methods of forming silicon layers
MICRON TECHNOLOGY INC5 citations74
US6391805B1May 21, 2002
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC3 citations74
US6242816B1Jun 5, 2001
Method for improving a stepper signal in a planarized surface over alignment topography
MICRON TECHNOLOGY INC10 citations74
US6153527ANov 28, 2000
Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material
MICRON TECHNOLOGY INC11 citations74
US6144109ANov 7, 2000
Method for improving a stepper signal in a planarized surface over alignment topography
MICRON TECHNOLOGY INC7 citations74
US6096626AAug 1, 2000
Semiconductor structures and semiconductor processing methods of forming silicon layers
MICRON TECHNOLOGY INC13 citations74
US6037261AMar 14, 2000
Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material
MICRON TECHNOLOGY INC8 citations74
US5030587AJul 9, 1991
Method of forming substantially planar digit lines
MICRON TECHNOLOGY INC18 citations74
US5892720AApr 6, 1999
Semiconductor memory with test circuit
MICRON TECHNOLOGY INC8 citations72
US7001816B2Feb 21, 2006
Embedded ROM device using substrate leakage
MICRON TECHNOLOGY INC3 citations63
US6903957B2Jun 7, 2005
Half density ROM embedded DRAM
MICRON TECHNOLOGY INC4 citations63
US6865130B2Mar 8, 2005
ROM embedded DRAM with bias sensing
MICRON TECHNOLOGY INC1 citations63
US6768664B2Jul 27, 2004
ROM embedded DRAM with bias sensing
MICRON TECHNOLOGY INC2 citations63
US6673726B1Jan 6, 2004
High-pressure anneal process for integrated circuits
MICRON TECHNOLOGY INC1 citations63
Showing the top 50 of 63 patents by PatentIndex Score.