P

Inventor

TSAI MENG-JIN

TW27 patents
⚠️ This page may combine multiple inventors who share the name “TSAI MENG-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

24 patents
US6077784AJun 20, 2000

Chemical-mechanical polishing method

UNITED MICROELECTRONICS CORP61 citations96
US5610743AMar 11, 1997

Liquid crystal display including concentric shapes and radial spokes which has an improved viewing angle

UNITED MICROELECTRONICS CORP58 citations96
US6156640ADec 5, 2000

Damascene process with anti-reflection coating

UNITED MICROELECTRONICS CORP45 citations93
US5920779AJul 6, 1999

Differential gate oxide thickness by nitrogen implantation for mixed mode and embedded VLSI circuits

UNITED MICROELECTRONICS CORP52 citations93
US6281694B1Aug 28, 2001

Monitor method for testing probe pins

UNITED MICROELECTRONICS CORP19 citations92
US6232197B1May 15, 2001

Metal-insulator-metal capacitor

UNITED MICROELECTRONICS CORP33 citations92
US6114220ASep 5, 2000

Method of fabricating a shallow trench isolation

UNITED MICROELECTRONICS CORP21 citations92
US6037201AMar 14, 2000

Method for manufacturing mixed-mode devices

UNITED MICROELECTRONICS CORP29 citations92
US5981379ANov 9, 1999

Method of forming via

UNITED MICROELECTRONICS CORP21 citations92
US5981353ANov 9, 1999

Method of forming a shallow trench isolation region

UNITED MICROELECTRONICS CORP23 citations92
US5926729AJul 20, 1999

Method for forming gate oxide layers of various predefined thicknesses

UNITED MICROELECTRONICS CORP31 citations92
US5913132AJun 15, 1999

Method of forming a shallow trench isolation region

UNITED MICROELECTRONICS CORP21 citations92
US6403487B1Jun 11, 2002

Method of forming separated spacer structures in mixed-mode integrated circuits

UNITED MICROELECTRONICS CORP28 citations91
US5965464AOct 12, 1999

Manufacturing method of double spacer structure for mixed-mode IC

UNITED MICROELECTRONICS CORP20 citations89
US6251748B1Jun 26, 2001

Method of manufacturing shallow trench isolation structure

UNITED MICROELECTRONICS CORP17 citations84
US6140156AOct 31, 2000

Fabrication method of isolation structure photodiode

UNITED MICROELECTRONICS CORP19 citations84
US6001735ADec 14, 1999

Dual damascene technique

UNITED MICROELECTRONICS CORP10 citations74
US6268266B1Jul 31, 2001

Method for forming enhanced FOX region of low voltage device in high voltage process

UNITED MICROELECTRONICS CORP13 citations69
US5500545AMar 19, 1996

Double switching field effect transistor and method of manufacturing it

UNITED MICROELECTRONICS CORP18 citations66
US7335598B2Feb 26, 2008

Chemical-mechanical polishing method

UNITED MICROELECTRONICS CORP3 citations63
US6913993B2Jul 5, 2005

Chemical-mechanical polishing method

UNITED MICROELECTRONICS CORP2 citations63
US6190983B1Feb 20, 2001

Method for fabricating high-voltage device

UNITED MICROELECTRONICS CORP4 citations63
US5937291AAug 10, 1999

Method for forming poly-via connection between load transistor drain and driver transistor gate in SRAM

UNITED MICROELECTRONICS CORP2 citations62
US7947603B2May 24, 2011

Chemical-mechanical polishing method

UNITED MICROELECTRONICS CORP0 citations52

UNITED MICROELECTRONICS

1 patent

UNITED MICROELECTRICS CORP

1 patent

WU KUN-LIN

1 patent