Inventor

KIM HEUI-SEOG

KR21 patents

⚠️ This page may combine multiple inventors who share the name “KIM HEUI-SEOG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM HEUI-SEOG

SAMSUNG ELECTRONICS CO LTD

Package stack and manufacturing method thereof

Management system for automated wire bonding process

Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package

POGO pin and test socket including the same

Insert block with pusher to push semiconductor device under test

Wafer table and semiconductor package manufacturing apparatus using the same

Printed circuit board and method thereof and a solder ball land and method thereof

Semiconductor device and method of manufacturing the same

Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

Method of manufacturing semiconductor package using redistribution substrate

Leadframe and semiconductor chip package having cutout portions and increased lead count

Method of processing a semiconductor wafer for manufacture of semiconductor device

Method of molding semiconductor package

Method of molding semiconductor package

Semiconductor device and method of manufacturing the same

Printed circuit board and method thereof and a solder ball land and method thereof

KO JUN-YOUNG

Method of molding semiconductor package

CHO SUNG-IL

Method for processing a substrate using a laser beam

SIN WHA-SU

Semiconductor package and method of manufacturing the semiconductor package