Inventor

SATO MITSUTAKA

JP52 patents

⚠️ This page may combine multiple inventors who share the name “SATO MITSUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SATO MITSUTAKA

FUJITSU LTD

Semiconductor device and method of producing the same

External connection terminal and semiconductor device

Semiconductor device having columnar electrode and method of manufacturing same

Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism

Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer

Semiconductor device

Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame

Semiconductor device and semiconductor device unit for a stack arrangement

Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes

Semiconductor device configured to be surface mountable

Semiconductor device and package including forming pyramid mount protruding through silicon substrate

Semiconductor device and method of producing the same

Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method

Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package

Semiconductor device affixed to an upper and a lower leadframe

Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe

Wire bonded device with ball-shaped bonds

Electronic device

Light signal processing system

External connection terminal and semiconductor device

Semiconductor module including a plurality of semiconductor devices detachably

Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal

Semiconductor module including a plurality of semiconductor devices detachably

Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure

Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure

Semiconductor device and semiconductor device module

Semiconductor device and semiconductor device unit

Single in-line package for surface mounting

Semiconductor device and semiconductor device mounting structure

Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal

Method of forming a device substrate and semiconductor package including a pyramid contact

Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer

Semiconductor device and method of producing the same

Process for manufacturing a single in-line package for surface mounting

Method of fabricating a semiconductor device

Method of designing circuit board

Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom

Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof

KANEKA CORP

Foamable vinyl chloride-base resin compositions

Master batch, polycarbonate resin composition, injection foam molded body and method for producing same

Foamable vinyl chloride resin composition

SATO MITSUTAKA

(Meth) acrylic polymer and vinyl chloride resin composition containing the same

Knife

FUJITSU SEMICONDUCTOR LTD

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

NEC CORP

Semiconductor device with connection terminals in the form of a grid array

SATO MAKOTO

AC-DC converter

FUJITSU MICROELECTRONICS LTD

Semiconductor device and method for fabricating the same

OZAWA KANAME

Adhesive layer forming a capacitor dielectric between semiconductor chips