Inventor
KIM KYUNGOE
KR27 patents
⚠️ This page may combine multiple inventors who share the name “KIM KYUNGOE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC PTE LTD
10 patentsUS11823973B2Nov 21, 2023
Package with compartmentalized lid for heat spreader and EMI shield
STATS CHIPPAC PTE LTD2 citations73
US11688718B2Jun 27, 2023
Semiconductor device and method of controlling warpage during LAB
STATS CHIPPAC PTE LTD2 citations70
US12107028B2Oct 1, 2024
Thermally enhanced FCBGA package
STATS CHIPPAC PTE LTD0 citations60
US12074135B2Aug 27, 2024
Semiconductor device and method of controlling warpage during LAB
STATS CHIPPAC PTE LTD0 citations60
US11929334B2Mar 12, 2024
Die-beam alignment for laser-assisted bonding
STATS CHIPPAC PTE LTD2 citations60
US11817357B2Nov 14, 2023
Region-of-interest positioning for laser-assisted bonding
STATS CHIPPAC PTE LTD0 citations60
US11670563B2Jun 6, 2023
Thermally enhanced FCBGA package
STATS CHIPPAC PTE LTD0 citations60
US12218114B2Feb 4, 2025
Semiconductor device and method of making a photonic semiconductor package
STATS CHIPPAC PTE LTD0 citations52
US12525557B2Jan 13, 2026
Die-beam alignment for laser-assisted bonding
STATS CHIPPAC PTE LTD0 citations50
US10109587B1Oct 23, 2018
Integrated circuit packaging system with substrate and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations49
STATS CHIPPAC LTD
6 patentsUS7851345B2Dec 14, 2010
Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding
STATS CHIPPAC LTD8 citations80
USRE44608ENov 26, 2013
Solder joint flip chip interconnection
STATS CHIPPAC LTD3 citations62
US8018052B2Sep 13, 2011
Integrated circuit package system with side substrate having a top layer
STATS CHIPPAC LTD4 citations61
US9373573B2Jun 21, 2016
Solder joint flip chip interconnection
STATS CHIPPAC LTD0 citations52
USRE44761EFeb 11, 2014
Solder joint flip chip interconnection having relief structure
STATS CHIPPAC LTD0 citations52
US7659633B2Feb 9, 2010
Solder joint flip chip interconnection having relief structure
STATS CHIPPAC LTD0 citations52
PENDSE RAJENDRA D
5 patentsUS8129841B2Mar 6, 2012
Solder joint flip chip interconnection
PENDSE RAJENDRA D29 citations92
US9773685B2Sep 26, 2017
Solder joint flip chip interconnection having relief structure
PENDSE RAJENDRA D6 citations84
US8810029B2Aug 19, 2014
Solder joint flip chip interconnection
PENDSE RAJENDRA D8 citations84
USRE44562EOct 29, 2013
Solder joint flip chip interconnection having relief structure
PENDSE RAJENDRA D3 citations62
US8216930B2Jul 10, 2012
Solder joint flip chip interconnection having relief structure
PENDSE RAJENDRA D3 citations62