Inventor

EID FERAS

US201 patents

⚠️ This page may combine multiple inventors who share the name “EID FERAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EID FERAS

INTEL CORP

Integrated circuit package with embedded bridge

Patch system for in-situ therapeutic treatment

Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber

Direct bonding in microelectronic assemblies

Thermal management solutions for stacked integrated circuit devices

Package with thermal interface material retaining structures on die and heat spreader

Radio frequency (RF) module with shared inductor

Microelectronic assemblies

Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies

Microelectronic package electrostatic discharge (ESD) protection

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Package assembly with hermetic cavity

Integrated circuit package with embedded bridge

Patch system for in-situ therapeutic treatment

Electrical connectors for high density attach to stretchable boards

Integrated circuit package with embedded bridge

Integration of pressure sensors into integrated circuit fabrication and packaging

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

Methods of forming sensor integrated packages and structures formed thereby

Direct bonding in microelectronic assemblies

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Thermal management solutions for stacked integrated circuit devices

Stacked package with electrical connections created using high throughput additive manufacturing

Hermetic sealing structures in microelectronic assemblies having direct bonding

Microelectronic assemblies with inductors in direct bonding regions

Thermal management in integrated circuit packages

Thermal management in integrated circuit packages

Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

Microelectronic assemblies

RF front end module including hybrid filter and active circuits in a single package

Diodes for package substrate electrostatic discharge (ESD) protection

Thermal management solutions for substrates in integrated circuit packages

Package spark gap structure

Multi-filter die

Microelectronic package with substrate-integrated components

Electrostatic discharge protection in integrated circuits

Die backend diodes for electrostatic discharge (ESD) protection

Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices

Package integrated security features

Electrostatic discharge protection in integrated circuits

Adaptable displays using piezoelectric actuators

Microelectronic package with mold-integrated components

Piezoelectric package-integrated film bulk acoustic resonator devices

TEH WENG HONG

Semiconductor package with mechanical fuse

LEE KYU OH

Integration of pressure or inertial sensors into integrated circuit fabrication and packaging

Lin kevin l

Semiconductor package with air pressure sensor

EID FERAS

Package integrated synthetic jet device