Inventor

ALEKSOV ALEKSANDAR

US229 patents

⚠️ This page may combine multiple inventors who share the name “ALEKSOV ALEKSANDAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALEKSOV ALEKSANDAR

INTEL CORP

Patch system for in-situ therapeutic treatment

Method of fabricating a stretchable computing device

Direct bonding in microelectronic assemblies

Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems

Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems

Radio frequency (RF) module with shared inductor

Multi-chip package with high density interconnects

Microelectronic package electrostatic discharge (ESD) protection

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Package assembly with hermetic cavity

Patch system for in-situ therapeutic treatment

Electrical connectors for high density attach to stretchable boards

Method of fabricating a stretchable computing device

System and method for providing tactile feedback

Magnetic attachment structure

High-density interconnects for integrated circuit packages

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

Direct bonding in microelectronic assemblies

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Hermetic sealing structures in microelectronic assemblies having direct bonding

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies

Thermal management in integrated circuit packages

Thermal management in integrated circuit packages

Electroless metal-defined thin pad first level interconnects for lithographically defined vias

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications

Diodes for package substrate electrostatic discharge (ESD) protection

Multi-chip package with high density interconnects

Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements

Package spark gap structure

Microelectronic assemblies

Microelectronic assemblies

Multi-filter die

Waveguide coupling systems and methods

Microelectronic package with substrate-integrated components

Electrostatic discharge protection in integrated circuits

Die backend diodes for electrostatic discharge (ESD) protection

Electroless metal-defined thin pad first level interconnects for lithographically defined vias

In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same

Electrostatic discharge protection in integrated circuits

RFIC having coaxial interconnect and molded layer

BRAUNISCH HENNING

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

ALEKSOV ALEKSANDAR

Shaped and oriented solder joints

Organic thin film passivation of metal interconnections