Inventor

SWAN JOHANNA M

US223 patents

⚠️ This page may combine multiple inventors who share the name “SWAN JOHANNA M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SWAN JOHANNA M

INTEL CORP

Patch system for in-situ therapeutic treatment

Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme

Techniques for die stacking and associated configurations

Microelectronic assemblies with communication networks

Shielded interconnects

Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme

Direct bonding in microelectronic assemblies

Serializer-deserializer die for high speed signal interconnect

Microelectronic assemblies having an integrated voltage regulator chiplet

Microelectronic assemblies

Microelectronic assemblies

Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems

Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems

Radio frequency (RF) module with shared inductor

Microelectronic assemblies

Microelectronic assemblies with communication networks

Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies

Microelectronic package electrostatic discharge (ESD) protection

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Package assembly with hermetic cavity

Optical I/O system using planar light-wave integrated circuit

Patch system for in-situ therapeutic treatment

Electrical connectors for high density attach to stretchable boards

Sacrificial redistribution layer in microelectronic assemblies having direct bonding

Glass core substrate for integrated circuit devices and methods of making the same

Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme

Direct bonding in microelectronic assemblies

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Stacked package with electrical connections created using high throughput additive manufacturing

Hermetic sealing structures in microelectronic assemblies having direct bonding

Microelectronic assemblies with communication networks

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies with communication networks

Microelectronic assemblies with communication networks

Thermal management in integrated circuit packages

Microelectronic assemblies

Thermal management in integrated circuit packages

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Microelectronic assemblies

BRAUNISCH HENNING

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

MA QING

Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

Glass core substrate for integrated circuit devices and methods of making the same

KOBRINSKY MAURO J

Optical I/O system using planar light-wave integrated circuit

GUZEK JOHN S

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same