Inventor
HO KUAN-LIN
TW55 patents
⚠️ This page may combine multiple inventors who share the name “HO KUAN-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
47 patentsUS10163754B2Dec 25, 2018
Lid design for heat dissipation enhancement of die package
TAIWAN SEMICONDUCTOR MFG CO LTD31 citations94
US10157871B1Dec 18, 2018
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations94
US9735043B2Aug 15, 2017
Semiconductor packaging structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US9865566B1Jan 9, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9812410B2Nov 7, 2017
Lid structure for a semiconductor device package and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9786520B2Oct 10, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9673119B2Jun 6, 2017
System and method for bonding package lid
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US12165946B2Dec 10, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11424220B2Aug 23, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11417643B2Aug 16, 2022
Package-on-package with redistribution structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11315862B2Apr 26, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10957672B2Mar 23, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10804245B2Oct 13, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10700031B2Jun 30, 2020
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10276508B2Apr 30, 2019
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10157863B2Dec 18, 2018
Method for forming a lid structure for a semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10157772B2Dec 18, 2018
Semiconductor packaging structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9893043B2Feb 13, 2018
Method of manufacturing a chip package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9805997B2Oct 31, 2017
Packaging methods for semiconductor devices with encapsulant ring
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9287233B2Mar 15, 2016
Adhesive pattern for advance package reliability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US12347802B2Jul 1, 2025
Die corner removal for underfill crack suppression in semiconductor die packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12062604B2Aug 13, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11824032B2Nov 21, 2023
Die corner removal for underfill crack suppression in semiconductor die packaging
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11749594B2Sep 5, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9941186B2Apr 10, 2018
Method for manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12424562B2Sep 23, 2025
Three-dimensional (3D) package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11972956B2Apr 30, 2024
Lid attach process and dispenser head
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908835B2Feb 20, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11894312B2Feb 6, 2024
Semiconductor packages and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11784106B2Oct 10, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11688693B2Jun 27, 2023
Semiconductor packages and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11616037B2Mar 28, 2023
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508640B2Nov 22, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11355461B2Jun 7, 2022
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11264304B2Mar 1, 2022
Semiconductor structure and associated method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011431B2May 18, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12417969B2Sep 16, 2025
Semiconductor structure and circuit structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11594479B2Feb 28, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10879140B2Dec 29, 2020
System and method for bonding package lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867835B2Dec 15, 2020
Semiconductor packaging structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658263B2May 19, 2020
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10622278B2Apr 14, 2020
Semiconductor structure and associated method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10515941B2Dec 24, 2019
Methods of forming package-on-package structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269679B2Apr 23, 2019
Semiconductor structure and associated method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269668B2Apr 23, 2019
System and method for bonding package lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9859265B2Jan 2, 2018
Package structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9415501B2Aug 16, 2016
Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
2 patentsCHEN CHIN-LIANG
1 patentShowing the top 50 of 55 patents by PatentIndex Score.