Inventor · disambiguated record
Leo A. Merilo
Also filed as: MERILO LEO · MERILO LEO A
12 granted patents·1 pending application·126 citations·filing 2002–2010
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0187US8026129B2Stacked integrated circuits package system with passive componentsSTATS CHIPPAC LTD·Filed 2006·Granted Sep 27, 2011·16 cites·20 claims
- 0287US7687892B2Quad flat packageSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·14 cites·17 claims
- 0384US6875634B2Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Apr 5, 2005·36 cites·21 claims
- 0483US9281300B2Chip scale module package in BGA semiconductor packageMERILO LEO A·Filed 2010·Granted Mar 8, 2016·9 cites·15 claims
- 0580US6737298B2Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted May 18, 2004·31 cites·18 claims
- 0678US8395254B2Integrated circuit package system with heatspreaderESPIRITU EMMANUEL·Filed 2006·Granted Mar 12, 2013·9 cites·20 claims
- 0771US7659608B2Stacked die semiconductor device having circuit tapeSTATS CHIPPAC LTD·Filed 2006·Granted Feb 9, 2010·4 cites·24 claims
- 0865US8138080B2Integrated circuit package system having interconnect stack and external interconnectFILOTEO JR DARIO S·Filed 2006·Granted Mar 20, 2012·4 cites·20 claims
- 0962US7439620B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 21, 2008·2 cites·20 claims
- 1060US7786575B2Stacked die semiconductor device having circuit tapeSTATS CHIPPAC LTD·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 1143US8097496B2Method of forming quad flat packageESPIRITU EMMANUEL A·Filed 2010·Granted Jan 17, 2012·0 cites·45 claims
- 1243US8097935B2Quad flat packageESPIRITU EMMANUEL A·Filed 2010·Granted Jan 17, 2012·0 cites·45 claims
- 1342US2008042265A1Chip scale module package in bga semiconductor packageMERILO LEO A·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →